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Halogen-free soldering flux

A flux and halogen technology, applied in the direction of welding medium, welding equipment, welding/cutting medium/material, etc., can solve problems such as non-compliance, halogen residues, environmental hazards, etc., and achieve low post-weld corrosion, high safety performance, The effect of saving extra expenses

Active Publication Date: 2013-07-31
浙江强力控股有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The main cost of traditional solder wire flux is rosin, halogen substances and solvents. There are many halogen residues in it, which is not in line with the current environmental protection trend. Moreover, it needs to be cleaned with Freon after welding, which has caused great harm to the environment.

Method used

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  • Halogen-free soldering flux
  • Halogen-free soldering flux
  • Halogen-free soldering flux

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] This embodiment is a halogen-free flux, including the following components:

[0017]

[0018]

[0019] Above-mentioned percentage is mass percentage;

[0020] The organic acid is succinic acid; the hydroxyaminocarboxylic acid is β-amino-α-hydroxycarboxylic acid; the surfactant is butylphenol polyoxyethylene ether; the corrosion inhibitor is benzotriazepam Azole; Described organic solvent is dehydrated alcohol.

[0021] The relevant materials and parameters of this embodiment are shown in Table 1.

Embodiment 2 to Embodiment 6

[0023] Embodiment 2 to Embodiment 6 are basically the same as Embodiment 1, except that the proportion of the components is different from that of Embodiment 1, and the relevant materials and parameters of Embodiment 2 to Embodiment 6 are shown in Table 1.

[0024] Table 1

[0025]

Embodiment 7

[0027] This embodiment is a halogen-free flux, including the following components:

[0028]

[0029]

[0030] Above-mentioned percentage is mass percentage;

[0031] The organic acid is adipic acid; the hydroxyaminocarboxylic acid is α-hydroxycarboxylic acid amide; the surfactant is octylphenol polyoxyethyl ether; the corrosion inhibitor is α-mercaptobenzothiazole; Described organic solvent is ethylene glycol benzoxazole.

[0032] The relevant materials and parameters of this embodiment are shown in Table 2.

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Abstract

The invention discloses a halogen-free soldering flux, which comprises the following components in percentage by mass: 5 to 20 percent of organic acid, 2.5 to 10 percent of hydroxamino carboxylic acid, 2 to 10 percent of glycollic acid, 0.5 to 2 percent of surfactant, 0.1 to 0.2 percent of corrosion inhibitor and the balance of organic solvent, wherein the organic acid is succinic acid, adipic acid or malic acid; the hydroxamino carboxylic acid is beta-amino-alpha-hydroxy carboxylic acid; the surfactant is alkylphenol polyoxyethylene ether or octylphenol polyoxyethylene ether; the corrosion inhibitor is benzotriazole, alpha-mercaptobenzothiazole or glycol benzole; and the organic solvent is absolute ethanol. The halogen-free soldering flux has the advantages of no halogen or lead and higher wettability.

Description

technical field [0001] The invention belongs to the technical field of soldering flux, and in particular relates to a halogen-free soldering flux. Background technique [0002] The RoHS (Restriction of Hazardous Substances) directive implemented on July 1, 2006 banned the use of six hazardous substances in electronic products and printed circuit boards, only polybrominated diphenyl ethers (PBDE) and polybrominated biphenyls (PBB) contained in halogens Limit. But in fact, in addition to polybrominated diphenyl ethers and polybrominated biphenyls, circuit boards and electronic products containing halogens will produce many by-products in the case of incomplete combustion, including dioxins (Dioxin) and furan-like compounds (Furan-like compounds) , and acidic or corrosive gases, these by-products are also potentially serious hazards to the environment and human health. As the world's requirements for environmental protection are getting higher and higher, people have stipulat...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/362
Inventor 赵图强
Owner 浙江强力控股有限公司
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