Ultrasonic vibration auxiliary grinding method of ultrahard linear microstructural surface
An ultrasonic vibration and microstructure technology, which is applied in the field of ultrasonic vibration-assisted grinding, can solve the problems of destroying the surface accuracy of the microstructure surface, and achieve the effects of reducing the phenomenon of crushing, avoiding interference and high processing efficiency.
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[0014] Specific embodiment one: combination Figure 1~2 It is explained that the ultrasonic vibration assisted grinding method described in this embodiment is implemented according to the following steps:
[0015] Step 1. Install the diamond profiling wheel 3 on the spindle 1 of the plane precision grinding machine, install the ultrasonic vibration table 2 on the precision grinding machine table 5, and fix the workpiece 4 to be ground on the upper end surface of the vibration table 2 The center of
[0016] Step 2: Apply one-dimensional ultrasonic vibration to the vibrating table through the ultrasonic generator, and at the same time drive the workpiece to be ground on the vibrating table to perform one-dimensional ultrasonic vibration. When grinding the parallel linear microstructure surface, that is, the surface of the V-shaped groove matrix Or the grating microstructure surface, use the rotating table to adjust the vibration direction of the one-dimensional ultrasonic vibration ...
Example Embodiment
[0018] Specific implementation manner 2: In step two of this implementation manner, the rotation speed of the grinding wheel is 3000 rpm. When the wheel speed is 3000rpm, the processing effect is the best, and the surface quality after processing is the highest. The other composition and connection relationship are the same as in the first embodiment.
Example Embodiment
[0019] Specific implementation mode 3: The ultrasonic vibration amplitude in step 2 of this implementation mode is 5 μm. When the amplitude is 5μm, the vibration effect is the best, and the surface quality after processing is the highest. The other components and connection relationship are the same as those in the first or second embodiment.
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