Membrane sticking electroplating process for lead frame and special device thereof

Abstract

The invention discloses a membrane sticking electroplating process for a lead frame and a special device thereof, which overcome the defects of low efficiency and indistinct outlines of electroplating areas in the conventional electroplating process for the lead frames. The membrane sticking electroplating process comprises the following steps of: performing preheating, membrane sticking, electroplating and dyestripping on a traveled lead frame substrate belt. The membrane sticking process comprises the following steps of: cutting a mucous membrane belt to form a plurality of protective membranes, sorting the protective membranes and laminating the protective membranes which are needed to be adhered to the lead frame substrate belt by using a pair of compression rollers. The membrane sticking electroplating special device for the lead frame comprises a preheating device, a membrane sticking device, an electroplating device and a dyestripping which are connected sequentially, wherein the membrane sticking device comprises a pair of the same membrane sticking machines which are arranged on both sides of the lead frame substrate belt; and a machine frame of each membrane sticking machine is provided with a wheel disc, a plurality of traction rollers, a cutting die, a guide die, a carrier roller and a pair of compression rollers. By the membrane sticking electroplating process, a production process which is performed by electroplating and pressing and is used for the lead frame and a special device thereof are provided for the society, so the continuity of production is improved greatly, and the outlines of electroplating areas are distinct and accurate.

Description

technical field [0001] The invention relates to the technical field of manufacturing semiconductor discrete devices, in particular to an electroplating process for a lead frame substrate strip and a special device thereof. Background technique [0002] Lead frame is an important discrete device for packaging electronic components such as transistors, diodes, potentiometers, capacitors and integrated circuits. It has a wide range of applications and a wide variety of models. At present, the more common lead frame structures are as attached figure 1 As shown, it includes a fixed block 1 at the end, a chip island 2 in the middle, and multiple pins 3 at the tail; in actual production and processing, the patent No. ZL200820153818. version" and patent number ZL200820153817.2 titled "a double-row double-row triode lead frame version" and other processing technologies to improve production efficiency. After the stamping process, it is also necessary to perform electroplating proce...

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to overcome the defects and deficiencies of the existing lead frame electroplating process, such as low efficiency, electroplating side leakage phenomenon, and unclear outline of the electroplating area, and provide the society with a simple and practical electroplating process for finished lead frame products with wide application range. The electroplating process and its special device with clear area outline can replace the traditional production process of stamping first and electroplating lead frame with electroplating first and then stamping, thus greatly improving the quality and production efficiency of lead frame products

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