Membrane sticking electroplating process for lead frame and special device thereof

A lead frame and electroplating process technology, which is applied to the electroplating process of the lead frame base material strip and its special device field, can solve the problems of unclear outline of electroplating area, side leakage of electroplating, low efficiency of electroplating process, etc., so as to shorten the electroplating time, Improved firmness and clear outline of plated areas
CN102168293AInactive Publication Date: 2011-08-31NINGBO HUALONG ELECTRONICS
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Patent Information

Authority / Receiving Office
CN ยท China
Patent Type
Applications(China)
Current Assignee / Owner
NINGBO HUALONG ELECTRONICS
Publication Date
2011-08-31
Estimated Expiration
Not applicable ยท inactive patent

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Abstract

The invention discloses a membrane sticking electroplating process for a lead frame and a special device thereof, which overcome the defects of low efficiency and indistinct outlines of electroplating areas in the conventional electroplating process for the lead frames. The membrane sticking electroplating process comprises the following steps of: performing preheating, membrane sticking, electroplating and dyestripping on a traveled lead frame substrate belt. The membrane sticking process comprises the following steps of: cutting a mucous membrane belt to form a plurality of protective membranes, sorting the protective membranes and laminating the protective membranes which are needed to be adhered to the lead frame substrate belt by using a pair of compression rollers. The membrane sticking electroplating special device for the lead frame comprises a preheating device, a membrane sticking device, an electroplating device and a dyestripping which are connected sequentially, wherein the membrane sticking device comprises a pair of the same membrane sticking machines which are arranged on both sides of the lead frame substrate belt; and a machine frame of each membrane sticking machine is provided with a wheel disc, a plurality of traction rollers, a cutting die, a guide die, a carrier roller and a pair of compression rollers. By the membrane sticking electroplating process, a production process which is performed by electroplating and pressing and is used for the lead frame and a special device thereof are provided for the society, so the continuity of production is improved greatly, and the outlines of electroplating areas are distinct and accurate.
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Description

technical field

[0001] The invention relates to the technical field of manufacturing semiconductor discrete devices, in particular to an electroplating process for a lead frame substrate strip and a special device thereof. Background technique

[0002] Lead frame is an important discrete device for packaging electronic components such as transistors, diodes, potentiometers, capacitors and integrated circuits. It has a wide range of applications and a wide variety of models. At present, the more common lead frame structures are as attached figure 1 As shown, it includes a fixed block 1 at the end, a chip island 2 in the middle, and multiple pins 3 at the tail; in actual production and processing, the patent No. ZL200820153818. version" and patent number ZL200820153817.2 titled "a double-row double-row triode lead frame version" and other processing technologies to improve production efficiency. After the stamping process, it is also necessary to perform electroplating proce...

Claims

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