Circuit board pin structure

Abstract

The invention provides a circuit board pin structure which comprises front-row pins, rear-row pins, a plurality of first leads, a plurality of second leads and a protective layer, wherein the front-row pins are provided with a plurality of first pins positioned on one surface of a circuit board, the first pins are arranged in parallel, and every two first pins have a first interval; the rear-row pins are provided with a plurality of second pins, the front-row pins and the rear-row pins are parallelly arranged on the margin of the surface of the circuit board at second intervals, the second pins are arranged in parallel, and every two second pins have a third interval; the plurality of first leads are positioned on the surface of the circuit board and are electrically connected with the first pins in one-to-one correspondence; the plurality of second leads are positioned in the circuit board and are electrically connected with the second pins in one-to-one correspondence by virtue of through holes on the surface of the circuit board; and the first pins and the second pins are arranged in a staggered mode, the first interval is same as the third interval, and the thickness of the second pins is larger than that of the first pins. By utilizing the circuit board pin structure provided by the invention, more pins can be designed under the condition of same pin width, thus a great number of input / output contacts can be added.

Description

Technical field [0001] The invention relates to a circuit board pin structure, in particular to a circuit board pin structure used in a liquid crystal display module. Background technique [0002] With the rapid development of electronic products toward lightness, thinness, shortness, and miniaturization, almost all portable electronic products use liquid crystal displays as their display panels, and liquid crystal displays are already an important component. In addition to the LCD panel, the liquid crystal display must be connected with a driving chip on its periphery for the control purpose of the display signal. At present, when adopting mainstream methods such as chip on glass technology COG (chip on glass) and chip on flex technology COF (chip on flex) to connect integrated circuits and liquid crystal panels, more and more conductive materials anisotropic conductive adhesive films are used. (Anisotropic Conductive Film; ACF) for thermal compression, because the electrical c...

AI Technical Summary

Problems solved by technology

At present, when using mainstream methods such as chip on glass technology COG (chip on glass) and chip on flexible substrate technology COF (chip on flex) to connect integrated circuits and liquid crystal panels, more and more conductive materials are used. Anisotropic conductive adhesive film (Anisotropic Conductive Film; ACF) for thermocompression, because to meet the electrical characteristics of ACF: 1. Minimum insulation group resistance 2. Minimum conduction resistance, so the pins of the printed circuit board are limited by the consideration of the minimum pitch, however Due to the material of the printed circuit board, the alignment accuracy of the machine, the size expansion and contraction caused by the hot pressing process, and other factors, a certain offset allowance must be preset when designing the pins, so that the pin pitch cannot be further reduced

In the prior art, the pins on the printed circuit board are all designed in a single row, so that the number of input / output (I / O) is limited when the pin pitch cannot be reduced.

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