Method for treating the surface of a planar object, planar object and use

A technology for treating surfaces and articles, which is applied in chemical/electrolytic methods to remove conductive materials, liquid processing of printed circuits, simultaneous processing of multiple printed circuits, etc. Or remove problems such as uneven speed processing, to achieve the effect of simplifying correction or positioning, improving accuracy, and reducing duration

Active Publication Date: 2011-08-31
AT & S AUSTRIA TECH & SYSTTECHN AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In connection with the processing of boards or large-format templates with correspondingly many printed circuit board elements, for example, the problem arises that the fine structures to be processed, which are defined, for example, by masks, are due to the aforementioned liquid medium for processing The problem of different removal rates or removal speeds in different partial areas is processed unevenly, resulting in, for example, non-uniform widths of the conductive structures to

Method used

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  • Method for treating the surface of a planar object, planar object and use
  • Method for treating the surface of a planar object, planar object and use
  • Method for treating the surface of a planar object, planar object and use

Examples

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Embodiment Construction

[0022]exist figure 1 In the example shown in the planar article consists of a board 1 with a plurality of printed circuit board elements 2, wherein as in particular with reference to the attached figure 2 It can be clearly seen that distributed on the surface to be treated of the flat article 1 , in particular between the individual printed circuit board elements 2 , a plurality of additionally located between the individual adjacent printed circuit board elements 2 Between, in particular slot-shaped openings or penetrations 3.

[0023] Depend on figure 1 It can be seen that the additional, in particular slot-shaped penetrations 3 are arranged in a substantially regular pattern, wherein respectively a plurality of such penetrations or openings 3 are substantially along the respectively parallel to the plate-shaped or A straight line arrangement of a boundary line 4 or 5 of the planar article 1 .

[0024] exist figure 2 Several printed circuit board components are also in...

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PUM

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Abstract

The present invention relates to a method for treating the surface of a planar object (1) by applying a liquid medium (6) to the surface (2) so as to change the structure and/or property of the surface (2) by at least partially removing material from the surface (2) due to the action of the liquid medium (6) on the material of the surface (2), wherein the liquid medium (6) that is applied or employed for treating the surface is removed therefrom at the boundary or edge regions (4, 5) of the surface disposed substantially horizontally during the treatment, it is proposed to additionally removethe liquid medium (6) applied for treating the surface (2) from the surface (2) to be treated in at least one area located at a distance from the boundary or edge regions (4, 5) of the surface (2), whereby evening of the surface (2) and/or the structures to be produced thereon can be achieved while the treatment or processing is performed. Such a method and such a planar object can preferably be used to produce printed circuit boards.

Description

technical field [0001] The invention relates to a method for treating the surface of a planar article by applying a liquid medium to the surface in order to modify the structure and / or properties of the surface, wherein the surface is at least partially removed by the action of the liquid medium on the material of the surface Material in which the liquid medium used to treat the surface is removed from the surface at the edge or edge region of the surface which is arranged substantially horizontally during the treatment. The invention furthermore relates to a flat article comprising a surface to be treated, wherein the structure and / or properties of the surface are changed by applying a liquid medium to the surface, wherein the material of the surface is at least partially removed by applying the liquid medium to the surface Materials for surfaces, from which a liquid medium for treating a surface is removed from an edge region or an edge region of a surface arranged substanti...

Claims

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Application Information

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IPC IPC(8): H05K3/00
CPCH05K3/0085H05K2203/175H05K2201/10356G09G2300/02H05K2201/0909H05K2201/10106H05K3/0097H05K2203/173G09G3/2085H05K1/189H05K2201/09236G09F9/30H05K2203/0746H05K2201/09063H05K2201/09036H05K3/06H05K3/0052H05K2201/10689
Inventor E·普莱纳C·凯泽M·蒙斯塞恩
Owner AT & S AUSTRIA TECH & SYSTTECHN AG
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