Fan-out high-density packaging structure

Abstract

The invention relates to a fan-out high-density packaging structure, which comprises a protective layer, a rewired metal layer, at least a group of wiring packaging layers, a top packaging layer and connection balls, wherein the rewired metal layer is embedded into the protective layer; and the connection balls are arranged below metals in a bottom opening of the protective layer. Compared with the prior art, the fan-out high-density packaging structure provided by the invention can form a finally packaged product comprising the whole system functions rather than a single chip function, reduces in-system resistance, in-system inductance and interference factors among chips, and in addition, can form a more complex multi-layer interconnected structure to realize wafer system-in-package of a higher integration level.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to a fan-out high-density packaging structure. Background technique [0002] With the continuous development of integrated circuit technology, electronic products are increasingly developing in the direction of miniaturization, intelligence, high performance and high reliability. The integrated circuit packaging not only directly affects the performance of integrated circuits, electronic modules and even the whole machine, but also restricts the miniaturization, low cost and reliability of the entire electronic system. With the gradual reduction of the size of the integrated circuit chip and the continuous improvement of the integration level, the electronic industry has put forward higher and higher requirements for the integrated circuit packaging technology. [0003] A package carrier is disclosed in the Chinese patent with the notification number CN1747156C. The package carrier boar...

AI Technical Summary

Problems solved by technology

[0004] The final product packaged and manufactured according to the above method has only a single chip function. However, with the trend of semiconductor products becoming thinner and smaller and the demand for product system functions constantly improving, how to further improve the integration of system-in-package has become an urgent need for those skilled in the art. solved problem

Images