Active cool type radiating substrate using air convection

A heat dissipation substrate and active heat dissipation technology, applied in the direction of electrical components, electric solid devices, circuits, etc., can solve problems affecting life and performance, and achieve low cost, good heat dissipation effect, and simple structure

Inactive Publication Date: 2011-09-14
SHAANXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Most of the current heat dissipation substrates are passive heat dissipation, and the substrate itself is used for heat conduction and heat dissipation. This way, high heat conduction and low hea

Method used

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  • Active cool type radiating substrate using air convection
  • Active cool type radiating substrate using air convection
  • Active cool type radiating substrate using air convection

Examples

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Embodiment Construction

[0020] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0021] see figure 1 as well as figure 2 , including a heat dissipation substrate 1 connected to a heat dissipation device and a heat dissipation hole 3 arranged on the heat dissipation substrate 1, the heat dissipation hole 3 is conical, cylindrical or spiral, and the heat dissipation hole 3 is single or multiple, and the heat dissipation hole The inner wall of 3 and the outer surface of the heat dissipation substrate 1 are provided with textures, the textures are threads or twill, the heat dissipation substrate 1 is an aluminum substrate, a copper substrate, a silicon substrate, a ceramic substrate or a composite substrate, and the heat dissipation substrate 1 is a round shape, square or polygon, the heat dissipation substrate 1 is provided with a connection groove 2, the heat dissipation device is fixed on the connection groove 2, the connection groove 2 ...

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Abstract

The invention provides an active cool type radiating substrate using air convection. The active cool type radiating substrate comprises a radiating substrate connected with a radiating device, and a radiating hole arranged in the radiating substrate. The active cool type radiating substrate enables the cold air and hot air to be circulated dynamically through the effective cross-ventilation of the radiating hole so as to enable the heat conduction and heat dissipation of the radiating substrate to be balanced dynamically for realizing stability. The active cool type radiating substrate solves the heat-carrying problem caused by high heat conduction and low heat dissipation of the existing radiating substrate, avoids continuous temperature rising of the radiating device, such as an LED (light-emitting diode), generates good radiating effect, reduces the radiating device service life and efficiency problems caused by thermal failure, and effectively ensures the normal work of the radiating device. The active cool type radiating substrate using air convection is simple in structure, low in cost and easy to realize volume production, and is an environment-friendly and resource-saving device.

Description

technical field [0001] The invention relates to a flat heat dissipation substrate, in particular to an active heat dissipation heat dissipation substrate utilizing air convection. Background technique [0002] As a high-efficiency lighting technology, LED light-emitting diodes have been widely used in many fields such as display and lighting in modern society. LED has many advantages such as small size, low power consumption, and long life. It is considered to be a new generation of lamps to replace traditional incandescent lamps and fluorescent lamps. However, the heat dissipation problem of high-power LEDs is one of the key issues hindering its development. The increase in temperature will cause many problems such as increased light attenuation and shortened life of LEDs. Therefore, the necessary heat conduction and heat dissipation structure is a breakthrough to solve the problem. [0003] Most of the current heat dissipation substrates are passive heat dissipation, us...

Claims

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Application Information

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IPC IPC(8): H01L33/64H01L23/467
Inventor 张方辉邱西振张静毕长栋
Owner SHAANXI UNIV OF SCI & TECH
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