High-reliability power supply clamping ESD (Electronic Static Discharge) protection circuit

An ESD protection and reliability technology, applied in emergency protection circuit devices, emergency protection circuit devices for limiting overcurrent/overvoltage, circuit devices, etc., can solve internal circuit damage, incomplete release, and shortened Mbig turn-on time and other problems, to achieve the effect of long opening time

Active Publication Date: 2011-09-14
PEKING UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] figure 1 Although the circuit shown is logically sound, as the size of the device shrinks, the reliability of its ESD protection performance faces a huge challenge
The continuous shrinking of the feature size of integrated circuits will inevitably require the R-C part of the ESD protection module to be as small as possible. Since the gate voltage of Mbig is pulled down after the R-C time constant has passed, the reduction of the R-C time constant will lead to a decrease in the turn-on time of Mbig. Shorten, which may lead to incomplete release of ESD charges and damage to internal circuits
On the other hand, for the fast-rising normal power-on voltage, it is hoped that the clamping transistor will not be turned on, that is, the ESD protection circuit will not be triggered by mistake, so the ESD protection circuit with strong anti-false trigger capability also requires the R-C time constant to be made very small , which would also contradict the sufficiently long turn-on time of the clamp transistor

Method used

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  • High-reliability power supply clamping ESD (Electronic Static Discharge) protection circuit
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  • High-reliability power supply clamping ESD (Electronic Static Discharge) protection circuit

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Embodiment Construction

[0028] The core idea of ​​the present invention is: separate the circuit structure for controlling the opening and closing of the clamping transistor, so that the R and C sizes of the detection circuit part can be set from a small time constant to prevent false triggering, and a large time constant to prevent false triggering. Get out of the paradoxical choice of getting enough clamp transistor turn-on time. In the circuit proposed by the present invention, the C-R structure of the detection circuit basically only plays a decisive role in the opening of the clamping transistor, and the closing of the clamping transistor is controlled by the time delay of the C-R time constant plus the two-stage R-C, like this The control effect of the C-R time constant of the detection circuit on the turn-off of the clamp transistor can be weakened by enlarging the time delay of R-C in the clamp transistor turn-off circuit, thereby making a small space for the C-R time constant.

[0029] fig...

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PUM

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Abstract

The invention relates to the technical field of integrated circuit chip ESD (Electronic Static Discharge) protection, in particular to a high-reliability power supply clamping ESD protection circuit. The ESD protection circuit comprises a capacitor-resistor module (1), a clamping transistor open module (2), a clamping transistor (4) which are connected in sequence; the ESD protection circuit also comprises a clamping transistor close module (3) which is respectively connected with the capacitor-resistor module (1) and the clamping transistor (4). According to the invention, through separating a circuit structure used for controlling the open and close of the clamping transistor, the clamping transistor can obtain enough open time under the condition that of the capacitor-resistor module in the ESD protection circuit has very small time constant.

Description

technical field [0001] The invention relates to the technical field of electrostatic discharge (ESD) protection of integrated circuit chips, in particular to a high-reliability power clamp ESD protection circuit. Background technique [0002] In the process of integrated circuit chip manufacturing, packaging, testing, transportation and use, there are many different electrostatic discharge modes. When these electrostatic charges accumulate on the gate of the MOS transistor, due to the small gate capacitance of the MOS transistor , These electrostatic charges will form a large equivalent gate voltage, resulting in the failure of the device or circuit, which is the ESD problem. Along with the scaling down of integrated circuit feature size, the gate oxide layer is made thinner and thinner, which makes ESD protection more difficult and important in nanometer-scale device and circuit design. [0003] An integrated circuit chip is mainly connected with the outside world through ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02H9/04
Inventor 陆光易王源贾嵩张钢刚张兴
Owner PEKING UNIV
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