Surface mounting light-emitting diode (LED) with high sealing property and production method thereof

Abstract

The invention is suitable for the technical field of a light-emitting diode (LED) and discloses a surface mounting LED with a high sealing property and a production method thereof. The surface mounting LED with the high sealing property comprises a bracket and a chip arranged on the bracket, wherein the bracket is provided with a big bowl part and a small bowl part which are up-and-down stacked and communicated; the big bowl part is located above the small bowl part; the chip is attached in the small bowl part; the small bowl part is also internally provided with packaging colloid covering on the chip; and the big bowl part is internally provided with a seal colloid covering on the packaging colloid. The production method of the surface mounting LED with the high sealing property comprises the following steps: arranging the bracket which comprises the big bowl part and the small bowl part which are up-and-down stacked and communicated, and mounting the chip inside the small bowl part; then injecting packaging colloid to the inside of the small bowl part, and then injecting seal colloid to the inside of the big bowl part. According to the surface mounting LED with the high sealing property and the production method thereof, the lighting effect of the product is excellent, and the reliability of the product is good.

Description

technical field [0001] The invention belongs to the technical field of LEDs, and in particular relates to a high-sealing performance surface mounting LED and a production method thereof. Background technique [0002] Most of the package sizes of SMD (Surface Mounted Devices, Surface Mount) LEDs on the market are 3020, 3528, 5050, etc. [0003] At present, there is only one bowl and cup on the LED bracket, and the encapsulation colloid used is silica gel, which is mainly because silica gel has good heat resistance. The well-made LED products have good performance in the initial lighting test, but most packaging companies have found that as time goes by, the products that are obviously good in random inspections will be soldered after high-temperature reflow soldering in client applications. There are often problems with the LED being off or slightly bright. The reason is that the traditional surface mount LED has only one bowl and cup part in the bracket. Water vapor is eas...

AI Technical Summary

Problems solved by technology

The well-made LED products have good performance in the initial lighting test, but most packaging companies have found that as time goes by, the products that are obviously good in random inspections will be soldered after high-temperature reflow soldering in client applications. There are often problems with the LED being off or slightly bright. The reason is that the traditional surface mount LED has only one bowl and cup part in the bracket. Water vapor is easy to enter from the joint between the colloid and the bracket, and cannot prevent moisture from entering. When it is applied to outdoor lighting and outdoor lighting, it is often damaged due to rainwater soaking, and the product reliability is poor; making the current surface mount LED only suitable for indoor use. Lighting or indoor lighting is not suitable for outdoor lighting and outdoor lighting, and the product has poor environmental adaptability

[0004] In addition, silica gel will absorb moisture in the air. During reflow (reflow soldering), part of the water vapor will evaporate to the outside of the silica gel under high temperature conditions, and part of the water vapor will not be able to volatilize to the outside of the silica gel, so it will be vaporized in the bowl and cup. The force generated by vaporization is greater than that of colloid. When the binding force is used, a popcorn effect is generated, causing the LED light to be off, and the product reliability is poor

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