mems microphone chip and manufacturing method thereof

Abstract

The invention provides an MEMS (micro electro mechanical system) microphone chip and a manufacture method thereof. The MEMS microphone chip comprises a substrate and a parallel plate capacitor arranged on the substrate, wherein one side of the parallel plate capacitor is opposite to the substrate; and the outer part of the other side of the parallel plate capacitor is provided with a protective device for protecting the main body structure of the MEMS microphone chip. In the MEMS microphone chip, a vibrating diaphragm is provided with the protective device so as to separate structures, such as tender vibrating diaphragms and the like in the parallel plate capacitor from the outer space of the MEMS microphone chip, so that the MEMS microphone chip can be prevented from being polluted in the cutting process so as to effectively improve manufacture process efficiency, lower production cost and improve production yield; and in addition, the chip can be fully protected in the subsequent installing and using process of the MEMS microphone chip.

Description

technical field [0001] The invention relates to a microphone chip and a manufacturing method thereof, in particular to a MEMS microphone chip and a manufacturing and packaging method thereof. Background technique [0002] In recent years, with the continuous reduction in volume and higher performance of electronic products such as mobile phones and notebooks, correspondingly, the volume of supporting electronic components is continuously reduced, and the performance and consistency are improved, and the use of MEMS (micro-electromechanical systems) ) process-integrated MEMS microphones have begun to be applied in batches to electronic products such as mobile phones and notebooks. Against this backdrop, the demand for MEMS microphones produced using MEMS process technology is rapidly increasing. A core device of the MEMS microphone is the MEMS microphone chip made by MEMS technology, which can complete the sound-to-electricity conversion function. [0003] figure 1 It is a...

AI Technical Summary

Problems solved by technology

For MEMS chips with this structure, there are mainly two cutting processes, one is water cutting, which is relatively cheap, but the vibration film and other areas in the parallel plate capacitor are very fragile and are easily contaminated during the cutting process; Another cutting process is laser cutting. Laser cutting can avoid the problem of contamination of MEMS chips, but the cost is very high and it is not suitable for mass production.

[0005] Moreover, in the MEMS chip manufacturing process, the through-holes in the substrate need to be formed by an etching process, and the problem of the large thickness of the substrate also brings difficulties to the etching process, resulting in low etching efficiency and low yield of MEMS chips; in addition, MEMS In the chip manufacturing process, the substrate is also required to have a certain thickness to prevent the chip from being damaged or broken, which further increases the cutting cost of the MEMS chip unit and reduces the cutting efficiency.

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