CLGA (Ceramic Land Grid Array) chip injection mold

Abstract

The invention discloses a CLGA (Ceramic Land Grid Array) chip injection mold. By changing an original push board ejection mode into a simple and reliable circular thimble ejection mode and improving the structure of inserts, the CLGA chip injection mold avoids the problem of big difficulty in cleaning the chip which is locally broken in a die insert during an ejection after being injected and molded; and by arranging a 0.001-0.002mm thick teflon coating on the head of an insert pin, the CLGA chip injection mold greatly improves de-molding capability of a cavity, reduces tightening force of a thin wall in a de-molding process and avoids the problem of breakage caused by overlarge local stress. By adopting a cavity vacuumizing technology and matching with the design of a unique S-shaped exhaust slot structure, the cavity is directly communicated with the air without resulting in the overflow of high-pressure fused mass in an injection filling process; and therefore, the effect of an exhaust system is greatly improved and the problem of easy gas tap of the chip, caused by no separation of the insert pin of each shaping circuit hole just like foreign test modes, is solved.

Description

technical field [0001] The invention relates to the technical field of precision injection molds, in particular to an injection mold specially used for processing CLGA LAND GRID ARRY SOCKET chips. Background technique [0002] CLGA LAND GRID ARRY SOCKET is a chip for supercomputer developed by American AIS (Amphenol Intercon System) company. Such as figure 1 with figure 2 As shown, the length and width of the chip are both 80.60mm, and the thickness is only 1.22mm. There are 3363 circuit contact mounting holes in the middle, and the distance between adjacent mounting holes is only 1.00mm. These holes are small in size and shape. Complex (for irregular shapes). At the same time, the chip has a very high requirement for chip flatness, which is 0.38mm, and the position requirement is 0.08mm, so the development of the injection mold for this chip is very difficult. Up to now, there is no mold manufacturing factory in China to develop such molds, and there are test molds dev...

AI Technical Summary

Problems solved by technology

[0009] The technical problem to be solved by the present invention is to provide a CLGA chip injection mold for the deficiencies of the prior art. Irregular shaped narrow grooves lead to problems that cannot be cleaned

[0010] Another problem to be solved by the present invention is to provide a CLGA chip injection mold to solve the problem that the existing mold cannot fully discharge the gas in the cavity within a very short injection filling time (<0.2s), resulting in injection molded products. Quality problems of filling unsaturation and carbonization of plastic melt

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