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Packaging and manufacturing methods for semiconductor with non-conducting layer

A manufacturing method and non-conductive layer technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve the problems of expensive gold and semiconductor structure prices that cannot be reduced

Inactive Publication Date: 2011-10-26
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although gold has good oxidation resistance, the price of semiconductor structures cannot be reduced due to the high price of gold

Method used

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  • Packaging and manufacturing methods for semiconductor with non-conducting layer
  • Packaging and manufacturing methods for semiconductor with non-conducting layer
  • Packaging and manufacturing methods for semiconductor with non-conducting layer

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Experimental program
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Embodiment Construction

[0043] refer to Figure 1A , which shows a cross-sectional view of a semiconductor package according to an embodiment of the present invention. A semiconductor package 100 includes a die 110 , a plurality of conductive pillars 112 and a nonconductive layer 120 .

[0044] Chip 110 has an active surface 110u. The conductive pillar 112 is disposed adjacent to the active surface 110 u of the chip 110 , and its material includes copper (Cu) or aluminum (Al). The conductive posts 112 can serve as input / output (I / O) contacts.

[0045] The non-conductive layer 120 is disposed adjacent to the active surface 110u of the chip 110, and completely covers the conductive pillars 112 and covers the active surface 110u. In this embodiment, the non-conductive layer 120 directly contacts and completely covers the side surface 112s and the end surface 112u of the conductive pillar 112 . The side 120s of the non-conductive layer 120 is substantially aligned with the side 110s of the chip 110 , ...

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PUM

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Abstract

The invention provides packaging and manufacturing methods for a semiconductor with a non-conducting layer. The manufacturing method comprises the followings steps: firstly, providing a substrate which comprises a plurality of chips; forming an active surface on which a plurality of conducting posts are close to the chips; forming the non-conducting layer covering the conducting posts completely; and finally simplifying the substrate.

Description

technical field [0001] The present invention relates to a semiconductor package and its manufacturing method, and in particular to a semiconductor package whose electrical contacts are completely covered and its manufacturing method. Background technique [0002] A conventional semiconductor structure includes a substrate, several electrical contacts, and a protective layer. The protective layer covers a part of the electrical contact, so that the exposed part of the electrical contact can be electrically contacted with an external circuit. In order to increase the area of ​​electrical contact, the exposed portion of the electrical contact usually includes the end surface and most of the sides, that is to say, the electrical contact is almost completely exposed to the atmosphere. [0003] However, the exposed parts of the electrical contacts are directly damaged by the atmospheric environment. For example, after the semiconductor structure is manufactured, it is usually pl...

Claims

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Application Information

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IPC IPC(8): H01L21/56H01L23/00H01L23/31
CPCH01L2224/16225H01L2224/73204H01L2224/81
Inventor 张效铨唐和明赖逸少蔡宗岳
Owner ADVANCED SEMICON ENG INC