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Radiation curable silicone composition

A technology of composition and siloxane, applied in the direction of coating, etc., can solve the problem of not realizing high-speed curing, and achieve the effect of high-speed curing and high photosensitivity effect

Inactive Publication Date: 2011-11-09
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, curing of radiation-curable silicone compositions is facilitated by adding photosensitizers (JP-A 2009-013317), however, no photosensitizer-containing radiation-curable silicone compositions superior to conventional ones have been achieved. The practical improvement of high-speed curing of

Method used

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  • Radiation curable silicone composition
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0054] To 100 parts by weight of the cationically polymerizable organopolysiloxane (a) corresponding to component (A) of the present invention represented by the following average composition formula (a):

[0055]

[0056] Wherein 6.5mol% of all organic groups are monovalent epoxy functional organic groups, and have a viscosity of 90mPa.s at 25°C, add 1.0 parts by weight of toluene solution to dissolve 50% by weight corresponding to the component of the present invention ( B) Bis[4-alkyl (C 10 -C 13 ) phenyl]iodonium hexafluoroantimonate (e), and 7.6% by weight of 9,10-dibutoxyanthracene (f) corresponding to component (C) of the present invention is added, and the mixture is uniformly stirred To prepare radiation curable silicone composition 1. This radiation curable silicone composition 1 was cured as described above, and the cured properties were determined by finger touch. The results are shown in Table 1. The peel strength of the film obtained by curing the radiatio...

Embodiment 2

[0058] To 100 parts by weight of the cationically polymerizable organopolysiloxane (d) corresponding to component (A) of the present invention represented by the following average composition formulas (b) and (c):

[0059]

[0060] Wherein 3.7mol% of all organic groups are monovalent epoxy functional organic groups, and have a viscosity of 150mPa.s at 25°C, add 1.0 parts by weight of toluene solution to dissolve 50% by weight of the components corresponding to the present invention (B) two [4-alkyl (C) as photoacid generator 10 -C 13 ) phenyl]iodonium hexafluoroantimonate (e), and 7.6% by weight of 9,10-dibutoxyanthracene (f) corresponding to component (C) of the present invention is added, and the mixture is uniformly stirred To prepare radiation curable silicone composition 2. This radiation curable silicone composition 2 was cured as described above, and the cured properties were determined by finger touch. The results are shown in Table 1. The peel strength of the f...

Embodiment 3

[0062] To 100 parts by weight of the organopolysiloxane (a) of Example 1, add 1.0 parts by weight of the toluene solution to dissolve 50% by weight of bis[4- Alkyl (C 10 -C 13 ) phenyl] iodonium hexafluoroantimonate (e), and 9,10-bis(2-ethylhexyloxy)anthracene (g) corresponding to component (C) of the present invention added in an amount of 7.6% by weight , and the mixture was uniformly stirred to prepare radiation curable silicone composition 3. This radiation curable silicone composition 3 was cured as described above, and the cured properties were determined by finger touch. The results are shown in Table 1. The peel strength of the film obtained by curing the radiation-curable silicone composition 3 was also measured according to the evaluation method described above. The results are shown in Table 1.

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Abstract

A radiation curable silicone composition which can be cured at a high speed even when the composition contains a photosensitizer is provided. The composition mainly comprises (A) 100 parts by weight of a cationic polymerizable organopolysiloxane having epoxy group represented by the following average compositional formula (1): R 1 m R 2 n SiO (4-m-n) / 2 (1) wherein R 1 represents a substituted or unsubstituted monovalent C 1 to C 10 hydrocarbon group, R 2 represents a monovalent organic group having epoxy group, m > 0, n > 0, and 0 < m+n <= 3; (B) 0.05 to 20 parts by weight of a photoacid generator which exhibits a catalytic action in radiation curing of the cationic polymerizable organopolysiloxane (A); and (C) 0.001 to 10 parts by weight of an anthracene compound having a photosensitizing effect represented by the following general formula (2): wherein R 3 and R 4 independently represent a substituted or unsubstituted monovalent C 1 to C 20 hydrocarbon group.

Description

technical field [0001] The present invention relates to a radiation curable silicone composition. Background technique [0002] Various methods have been used for the curing of silicone compositions. Known methods include, for example, condensation by using organometallic compounds, vulcanization by using organic peroxides, and hydrosilylation by using platinum group metal catalysts. Since these methods all require heating, their energy efficiency is low, and a method with improved energy efficiency is required for increasing productivity and satisfying the recent trend of energy saving due to global warming. Accordingly, methods of curing using radiation have attracted attention since no heat is involved in curing. Among these methods, a curing method using a compound (photoacid generator) that generates an acid by irradiation with a radiation beam to achieve ring-opening of an epoxy group by cationic polymerization, since compared with the conventional radiation polymeri...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06C08J3/28C08J3/24
CPCC09D183/06C08G59/3281C08G77/14C08L2312/06C08K5/06C08G77/38C08K5/0025C08G59/68C08K5/59C08L83/06
Inventor 田中贤治入船真治
Owner SHIN ETSU CHEM IND CO LTD
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