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Image sensing device

A technology of image sensing and photosensitive unit, which is applied in radiation control devices, semiconductor/solid-state device components, semiconductor devices, etc., and can solve problems such as poor flatness, reduced light utilization efficiency, and difficulty in reaching 100% transmittance.

Active Publication Date: 2011-11-09
异基因开发有限责任公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the prior art, the spacer 120 needs to be used to support the cover glass 130, but since both the spacer 120 and the cover glass 130 have thickness, the thickness of the image sensing device 100 will be thickened.
Moreover, if the flatness of the spacer 120 and the cover glass 130 is not good, it will affect the light path, resulting in a decrease in image sensing quality.
In addition, the light transmittance of the protective glass 130 is difficult to reach 100%, so the light utilization efficiency will be reduced.

Method used

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Embodiment Construction

[0050] image 3 is a schematic cross-sectional view of an image sensing device according to an embodiment of the present invention. Please refer to image 3 , the image sensing device 200 of this embodiment includes an image sensing chip 210 , an optical module 220 and a protection member 230 . The image sensing chip 210 has a front side 211 , and the front side 211 has an image sensing area 212 . The optical module 220 includes a cylinder body 222 and at least one light-transmitting member 224 . The cylinder 222 is directly disposed on the front surface 211 and surrounds the image sensing area 212 , and the light-transmitting member 224 is disposed in the cylinder 222 and is opposite to the image sensing area 212 . The protection member 230 covers the area of ​​the front surface 211 outside the optical module 220 and surrounds the barrel 230 .

[0051] The aforementioned image sensor chip 210 may be a front-illuminated CMOS image sensor chip or a back-illuminated CMOS ima...

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PUM

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Abstract

The invention discloses an image sensing device, which comprises an image sensing chip, an optical module and a protection piece, wherein the image sensing chip has a front face which is provided with an image sensing region; the optical module comprises a barrel and at least one transparent piece; the barrel is directly arranged on the front face and encircles the image sensing region; the transparent piece is arranged in the barrel and opposite to the image sensing region; and the protection piece covers a region, positioned outside the optical module, of the front face and encircles the barrel. The image sensing device is thinner.

Description

technical field [0001] The present invention relates to a sensing device, and in particular to an image sensing device. Background technique [0002] figure 1 is a schematic cross-sectional view of an existing image sensing device, and figure 2 are multiple figure 1 A schematic diagram of the image sensing device wafer. Please refer to figure 1 and figure 2 , the image sensing device 100 cut from the wafer 50 includes an image sensing chip 110 , a spacer 120 , a protective glass 130 and a lens module 140 . The front surface 111 of the image sensing chip 110 has an image sensing region 112 , and the image sensing region 112 is provided with a plurality of photosensitive units 114 arranged in an array. Each photosensitive unit 114 is provided with a color filter pattern 116 , and each color filter pattern 116 is provided with a micro lens 118 . In addition, the spacer 120 is disposed on the front surface 111 of the image sensing chip 110 and surrounds the image sensin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/146H01L23/29H01L23/10
Inventor 李宗谕
Owner 异基因开发有限责任公司