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Method for improving light emitting efficiency of blue-green LED (Light-Emitting Diode) on silicon substrate

A technology of light extraction efficiency and blue-green light, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low light output efficiency, low luminous efficiency, and high working voltage of silicon-based LEDs, and achieve improved light output efficiency, high crystal quality, and large size effect

Inactive Publication Date: 2013-03-20
山西思科达科技有限公司
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Problems solved by technology

However, there are currently difficulties such as cracks caused by material mismatch, low luminous efficiency, high operating voltage, and poor reliability, and have not been mass-produced.
In addition, the strong absorption of blue-green light by silicon materials leads to low light extraction efficiency of silicon-based LEDs, which is also a major factor affecting Si as an LED substrate material.

Method used

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  • Method for improving light emitting efficiency of blue-green LED (Light-Emitting Diode) on silicon substrate
  • Method for improving light emitting efficiency of blue-green LED (Light-Emitting Diode) on silicon substrate
  • Method for improving light emitting efficiency of blue-green LED (Light-Emitting Diode) on silicon substrate

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Embodiment Construction

[0017] Such as figure 1 , figure 2 As shown, the present invention improves the method for blue-green LED light extraction efficiency on silicon substrate, carries out according to the following steps: the first step, with SiO 2 As the bottom layer of the substrate, SiO 2 The formula for calculating the thickness of layer 3 is: Where: λ is the wavelength of blue-green light, n 2 for SiO 2 The refractive index of k is an integer.

[0018] The second step, using Si as the second layer of the substrate, the calculation formula of the thickness of Si layer 2 is: Where: λ is the wavelength of blue-green light, n 1 is the refractive index of Si, and k is an integer.

[0019] Step 3: growing a GaN layer 1 on the Si layer.

[0020] The SiO 2 Both layer 3 and Si layer 2 are multilayer, multilayer SiO 2 Layer 3 and multi-layer Si layer 2 are arranged at intervals, and the bottom layer is SiO 2 Layer 3, the topmost layer is the Si layer 2, and the GaN layer 1 is disposed ab...

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Abstract

The invention provides a method for improving light emitting efficiency of a blue-green LED ((Light-Emitting Diode) on a silicon substrate, belonging to the technical field of growth of a GaN-based LED with Si as a substrate, aiming at solving the technical problem of providing a method capable of improving the light emitting efficiency of the blue-green LED on the silicon substrate. The adopted technical scheme comprises that the method for improving the light emitting efficiency of the blue-green LED on the silicon substrate is carried out according to the following steps of: firstly, taking SiO2 as a bottom layer of a substrate; secondly, taking Si as a second layer of the substrate; and thirdly, growing a GaN layer on the Si layer. In the invention, absorption of a substrate material to blue-green lights is reduced by utilizing interface reflection effects of different materials such as GaN, Si and SiO2, and the light emitting efficiency of the LED can be improved.

Description

technical field [0001] The invention discloses a method for improving the light extraction efficiency of a blue-green LED on a silicon substrate, belonging to the technical field of growing GaN-based LEDs with Si as a substrate. Background technique [0002] The substrate is the cornerstone of the technological development of the semiconductor lighting industry, and the substrate material determines the performance index of the device. Due to the high technical difficulty, only a few companies such as Cree and Nichia have the ability to develop substrate materials. Among them, Cree mainly makes SiC substrates, and Nichia mainly makes sapphire substrates. At present, only sapphire and silicon carbide substrates are used for mass production of GaN epitaxial wafers, and other substrates such as Si and ZnO are still in the stage of research and development or small batch production. [0003] Using Si as a substrate to grow GaN-based LEDs is a technology path that the industry h...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
Inventor 秦海滨张志成郭强张彦伟
Owner 山西思科达科技有限公司