A chip welding method

Abstract

The invention discloses a chip welding method. The chip welding method includes the steps of firstly, applying solder 32 to the surface of a pad 3 of a substrate 2; secondly, aligning a pad surface 31 of a chip 1 to the pad 3 of the substrate for mounting by a manipulator; thirdly, heating the chip with the chip well mounted to solidify the solder 32 by a reflow oven to complete chip welding. In certain cases, reinforcement is needed to make welding more reliable. The chip welding method is substitutive for traditional chip lead bonding and flip-chip packaging technology, production efficiency is improved, and production cost is decreased.

Description

technical field [0001] The invention relates to the field of electronic component welding, in particular to the field of chip welding, in particular to a chip welding method, which can be widely used in the fields of chip packaging, smart card packaging, electronic product assembly and the like. Background technique [0002] The application of surface mount technology has been widely used in today's electronic product assembly industry. It is a production technology with high production efficiency, universal equipment and high degree of automation. However, the components to be mounted are all components that have been packaged twice. The cost of component packaging is high, and the product volume is large. Especially in some applications such as smart card products that require small and ultra-thin requirements, it cannot be realized. . In order to achieve such application requirements, flip-packaging technology has emerged in the industry, that is, gold balls are made on ...

AI Technical Summary

Problems solved by technology

Although this process can achieve ultra-thin process requirements, its production equipment is special-purpose equipment, which is expensive and has low production efficiency, which is 1 / 3~1 / 5 of traditional surface mount equipment. Production requires a large investment in equipment to achieve

[0003] The price of the raw material unidirectional anisotropic conductive adhesive using the flip-down packaging process is expensive, and the performance of the product is greatly affected by external factors, such as ambient temperature, air dust, pressure and other conditions, which will cause changes in the welding effect, which has obvious potential for welding failure. risk

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