Packaging technology of IPMC (ionic polymer metal composite) driver

A packaging process and driver technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, electrical components, etc. The problem of poor bonding force with the IPMC driver can ensure the sealing performance, eliminate the relaxation effect, and achieve the effect of tight bonding.

Inactive Publication Date: 2012-01-04
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] When IPMC is used as a driver, there are two obvious defects: On the one hand, under the action of DC voltage, the IPMC driver usually bends rapidly toward the anode, and then slowly deforms toward the cathode (patent ZL200810150783.6)
However,

Method used

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  • Packaging technology of IPMC (ionic polymer metal composite) driver
  • Packaging technology of IPMC (ionic polymer metal composite) driver
  • Packaging technology of IPMC (ionic polymer metal composite) driver

Examples

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Embodiment Construction

[0023] Below, the present invention will be described in further detail by taking the strip-shaped IPMC driver (40mm×5mm) as an example.

[0024] A packaging process for an IPMC driver, comprising the steps of:

[0025] (1) Make the IPMC driver and connect the lead electrodes

[0026] Connect upper and lower surface electrodes 3 respectively on the upper and lower surfaces of the IPMC core layer 2 to form an IPMC driver; make two initial lead-out electrodes 1, one of which is bonded to the edge of the upper surface electrode at one end of the IPMC driver, and the other is bonded to the IPMC driver. The edge bonding of the electrode on the lower surface of the terminal ( figure 1 ), and then the IPMC driver with the initial lead-out electrode 1 is put into deionized water as a whole to soak and fully absorb water;

[0027] The initial lead-out electrode 1 is cut into a 10mm×5mm electrode sheet with a conductive copper foil, and can also be cut into the same shape and size wit...

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Abstract

The invention discloses a packaging technology method of an IPMC (ionic polymer metal composite) material driver. The packaging technology is characterized by taking a PTFE membrane (Poly Tetra Fluoro Ethylene) as a packaging material, and bonding the IPMC and the PEFE membrane by PDMS (Polydimethylsiloxane). The technology process comprises four parts: (1) manufacturing an extraction electrode by using a conducting film material, and bonding the extraction electrode with the IPMC driver; (2) coating PDMS jelly on the surface of the PTFE film, and manufacturing an upper packaging membrane anda lower packaging membrane for packaging the IPMC driver; (3) clamping the IPMC driver with the extraction electrode between the upper packaging membrane and the lower packaging membrane, and drying and curing the packaged integral driver under a pressurization condition; and (4) processing the material after packaging. The technology provided by the invention is simple, and has low cost, and experiments prove that the packaged IPMC driver has stable performances, can be used for a long time in air, and has greater popularization value.

Description

technical field [0001] The present invention relates to a kind of encapsulation process of ionic polymer-metal composite material (IPMC) driver, be specifically related to use polydimethylsiloxane (PDMS) to bond IPMC driver and polytetrafluoroethylene (PTFE) film both as a whole Sealed workmanship. Background technique [0002] Ionic polymer-metal composite (IPMC) is an ionic electro-actuated polymer with light weight, good flexibility, rapid response and bidirectional reversible functions of sensing-actuation, which can be used to make electromechanical transducers such as drives Devices to replace traditional piezoelectric ceramics are new smart materials that have emerged in the past two decades and have great application potential. [0003] When IPMC is used as a driver, there are two obvious defects: on the one hand, the IPMC driver usually bends rapidly toward the anode under the action of DC voltage, and then slowly deforms toward the cathode (patent ZL200810150783.6...

Claims

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Application Information

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IPC IPC(8): H01L41/26H01L41/053H01L41/45
Inventor 陈花玲朱子才王永泉罗斌常龙飞
Owner XI AN JIAOTONG UNIV
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