Method for manufacturing flexible printed circuit board

Abstract

The invention provides a method for manufacturing a flexible printed circuit board. The method comprises the following steps of: 1, directly pressing a complete covering film onto a circuit substrate with an etched circuit pattern; 2, printing alkali resistant ink on the covering film according to the circuit pattern, and curing; 3, etching a region out of the protection of the ink on the covering film by using an alkaline solution to expose the circuit pattern on the circuit substrate, and performing surface treatment to obtain the flexible printed circuit board. By the method, drilling and blanking processes of the covering film are eliminated, and the cost and processes are reduced greatly; meanwhile, the difficulties in adhering and aligning of the covering film by the conventional process are overcome, the production efficiency of the flexible printed circuit board is improved, and the manufacturing cycle is shortened. Compared with the manufacturing process for the common flexible printed circuit board, the method has the advantages that: production processes are reduced, and manufacturing difficulty is lowered, so the production cost is reduced greatly, the manufacturing cycle is shortened, the production efficiency is improved significantly, and finished products have an obvious price advantage.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a flexible ink circuit board. Background technique [0002] Recently, the competition of flexible printed circuit board manufacturing factories in the market has become more and more fierce, which directly leads to the continuous reduction of the price of FPC, which requires the continuous reduction of the production cost of flexible printed circuit boards (hereinafter referred to as: FPC) to be able to Respond to market changes and needs, especially ink boards such as LED light bars that are relatively less difficult to produce. [0003] The circuit material of the flexible ink circuit board is copper, and it is generally necessary to cover the circuit with a layer of cover film. The material of the cover film is generally polyimide, which has good insulation performance. The boards are tightly bonded together and pressed together to protect th...

AI Technical Summary

Problems solved by technology

There will be some windows on the cover film to expose the pads. After surface treatment, they are used to connect with other electronic components to achieve the purpose of electrical communication. The traditional method is to first open the window on the cover film, which generally requires drilling and punching. The next step is to print the ink on the cover film again according to the graphics on the finished product, and the accuracy of the window opening is high. The traditional method may cause poor alignment, and the processing procedure is cumbersome and the manufacturing cycle is long.

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