Heat dissipation method and device

Abstract

The invention provides a heat dissipation method and a heat dissipation device. In the method, the temperatures of key nodes in physical partitions are monitored in the physical partitions which are isolated by inserting single plates, pallets or dummy panels and the like which directly reach a backplane into slot positions, and the rotating speeds of fans in the physical partitions are determined according to the monitored temperatures of the key nodes in the physical partitions. By the method and the device, all the slot positions are partitioned into the isolated physical partitions by the single plates, the pallets or the dummy panels and the like in a frame, and the single plates, the pallets or the dummy panels and the like directly reach the backplane, so that the independence of all the physical partitions can be ensured, the mutual interference among different physical partitions is avoided, the accuracy of the rotating speeds of the fans can be ensured, the waste of fan power is avoided, and the noise of the fans is reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of medium and high-power plug-in box systems, in particular to a heat dissipation method and device. Background technique [0002] With the rapid development of integrated circuit technology, the integration of high-power plug-in electronic equipment represented by large-scale communication equipment and blade servers is getting higher and higher, and the functions are becoming more and more complex, and the power consumption of equipment is also increasing. The larger the size, the higher the requirements for the heat dissipation of the device. But when the heat dissipation of the cooling fan is larger, its noise is also just bigger. In order to meet the requirements of green and environmental protection, it is necessary to optimize the heat dissipation scheme as much as possible under the premise of meeting the heat dissipation requirements of the system, improve heat dissipation effic...

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides a heat dissipation method and device, which are used to solve the problems of large fan heat dissipation power and loud noise in order to meet the heat dissipation effect in the prior art when the whole machine is radiated heat.

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