Heat dissipation method and device

A heat dissipation method and physical partition technology, which can be used in pump installations, cooling/ventilation/heating renovation, sustainable buildings, etc., and can solve problems such as high noise and high cooling power of fans

Active Publication Date: 2012-01-04
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In view of this, the present invention provides a heat dissipation method and device, which are used to solve the problems of large fan heat dissipation power and loud noise in order to meet the heat dissipation effect in the prior art when the whole machine is radiated heat.

Method used

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Embodiment Construction

[0021] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] In order to reduce the heat dissipation efficiency of the fan and reduce the noise of the fan, the present invention provides a heat dissipation method and device.

[0023] figure 1 A schematic diagram of a heat dissipation process provided by the present invention, the process includes the following steps:

[0024] S101: For each isolated physical partition, monitor the temperature of key nodes in the physical partition, where each physical partition is isolated by inserting a single board, tray or dummy panel directly into the backplane in the...

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Abstract

The invention provides a heat dissipation method and a heat dissipation device. In the method, the temperatures of key nodes in physical partitions are monitored in the physical partitions which are isolated by inserting single plates, pallets or dummy panels and the like which directly reach a backplane into slot positions, and the rotating speeds of fans in the physical partitions are determined according to the monitored temperatures of the key nodes in the physical partitions. By the method and the device, all the slot positions are partitioned into the isolated physical partitions by the single plates, the pallets or the dummy panels and the like in a frame, and the single plates, the pallets or the dummy panels and the like directly reach the backplane, so that the independence of all the physical partitions can be ensured, the mutual interference among different physical partitions is avoided, the accuracy of the rotating speeds of the fans can be ensured, the waste of fan power is avoided, and the noise of the fans is reduced.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of medium and high-power plug-in box systems, in particular to a heat dissipation method and device. Background technique [0002] With the rapid development of integrated circuit technology, the integration of high-power plug-in electronic equipment represented by large-scale communication equipment and blade servers is getting higher and higher, and the functions are becoming more and more complex, and the power consumption of equipment is also increasing. The larger the size, the higher the requirements for the heat dissipation of the device. But when the heat dissipation of the cooling fan is larger, its noise is also just bigger. In order to meet the requirements of green and environmental protection, it is necessary to optimize the heat dissipation scheme as much as possible under the premise of meeting the heat dissipation requirements of the system, improve heat dissipation effic...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20F04D27/00
CPCH05K7/20Y02B60/1275F04D27/004G06F1/206G06F1/20F04D25/166F04D27/00Y02B30/70Y02D10/00
Inventor 吴俊朱寿礼
Owner ZTE CORP
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