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Power supply device with feeder shielding device and substrate processing device thereof

A substrate processing device and shielding device technology, applied in the direction of magnetic field/electric field shielding, circuit, discharge tube, etc., can solve problems such as difficulty in maintaining uniformity of plasma density, and achieve the effect of ensuring uniformity of plasma density and uniform treatment

Active Publication Date: 2016-04-27
JUSUNG ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when one-piece plate electrodes or multiple divided electrodes are used for plasma discharge, it is difficult to maintain the uniformity of plasma density inside the reaction space due to various factors.

Method used

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  • Power supply device with feeder shielding device and substrate processing device thereof
  • Power supply device with feeder shielding device and substrate processing device thereof
  • Power supply device with feeder shielding device and substrate processing device thereof

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Embodiment Construction

[0036] The preferred embodiments of the present invention are described below, but the present invention is not limited to the following embodiments. Those skilled in the art can make various changes and modifications without departing from the detailed description and accompanying drawings of the present invention. Variations and modifications to the foregoing will be apparent to those skilled in the art.

[0037] figure 1 It is a cross-sectional view of a substrate processing apparatus according to an embodiment of the present invention.

[0038] The substrate processing apparatus 110 of the present invention includes a process chamber 112 , a plurality of plasma sources 114 serving as sources, a power supply device 122 , a plurality of protrusions 170 , a gas distribution device 118 and a substrate placement device 116 . The substrate processing apparatus 110 may further include a gas supply pipe 172 , an edge frame 120 , a gate valve (not shown), and an exhaust port 124 ....

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Abstract

The invention discloses a power supply device with a feeder shielding device and a substrate processing device thereof. The substrate processing device includes: a process chamber in which a chamber cover and a chamber body are combined to provide a reaction space; a source electrode disposed inside the process chamber; an RF power supply supplying RF power to the source electrode; and connecting the The source and the feed line of the RF power supply; and a shielding device surrounding the feed line and shielding the electric field of the feed line.

Description

technical field [0001] The invention relates to a power supply device with a feeder shielding device for the purpose of shielding the electric field of a feeder and a substrate processing device thereof. Background technique [0002] Usually, the manufacture of semiconductor elements, display devices, and thin-film solar cells requires a thin-film deposition process that deposits a specific substance on a substrate, a photographing process that uses a photosensitive material to expose or conceal a selected area of ​​​​the film, and a thin-film process that removes a selected area. etching process, etc. Among these processes, the thin film plating process and etching process are carried out in a substrate processing apparatus optimized for a vacuum state. [0003] Generally speaking, the key to the thin film plating process or etching process is to uniformly supply activated or ionized process gas to the substrate by plasma discharge. However, when one-piece plate electrode...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32H05K9/00
CPCH01J37/32091H01J37/3244H05K9/00H01J37/32577H05H1/46C23C16/50H01J37/32568H01J37/32532C23C16/505
Inventor 都在辙全富一宋明坤李政洛
Owner JUSUNG ENG