Photoetching registration mark protective device and metal sputtering technological method

Abstract

The invention discloses a photoetching registration mark protective device, which comprises a plurality of press blocks for fixing wafers, wherein each press block is provided with a barrier strip extending outwards to the upper part of the corresponding wafer and is used for shielding a photoetching registration mark on the wafer. The invention further provides a metal sputtering technological method with application of the photoetching registration mark protective device, and the method comprises the steps of: rotating the outwards-extending barrier strip on each press block on a plane parallel to the wafer fixed by the press block so as to make the barrier strip shield the photoetching registration mark reserved on the wafer due to previous-layer process; and performing metal sputtering operation on each wafer and sputtering a metal layer on an area beyond the area, shielded by the corresponding barrier strip, on the wafer. In the invention, one barrier strip extending out to the upper part of the corresponding wafer is arranged on each press block for fixing the wafer and can be used for shielding the photoetching registration mark on the wafer in a metal sputtering technological process so as to make the photoetching registration mark clear in appearance, and in subsequent photoetching procedures, accurate alignment can be performed, so that the normal operation of a photoetching procedure is ensured.

Description

technical field [0001] The invention relates to the field of semiconductor chip processing, in particular to a protection device for photolithography registration marks and a metal sputtering process method. Background technique [0002] For chips that need to use thick metal layers, such as DMOS products are characterized by high current and high voltage applications, and high current and high voltage limit the need for sputtering thicker metal layers such as metal aluminum layers when making chips . [0003] However, if a thicker metal layer such as an aluminum layer covers the photolithography registration marks left by the previous layer process steps, it may seriously affect the morphology of the alignment marks, resulting in photolithography after the sputtering process. Difficulties in aligning during the etching process or even impossible to complete photolithography. [0004] The solution to the traditional semiconductor chip processing technology includes control...

AI Technical Summary

Problems solved by technology

[0006] An embodiment of the present invention provides a protective device for photolithographic registration marks, which is used to solve the problem in the prior art that the subsequent process of making a metal layer blocks the photolithographic registration marks left by the previous process steps, resulting in photo The engraving machine has the problem of alignment difficulties in the photolithography process

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