Formula for production of non-setting adhesive and preparation method thereof
A formulation and resin technology, applied in the direction of adhesives, film/sheet adhesives, non-polymer organic compound adhesives, etc. problem, to achieve the effect of good stickiness, aging resistance, flame retardant, production cost, and low residual odor.
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[0009] The weight percentage composition of the adhesive production formula is: ethyl methacrylate 2%, butyl acrylate 10%, hydroxypropyl acrylate 2%, hydroxyethyl acrylate 2%, vinyl acetate 3.99%, SBS resin 3%, Brominated polystyrene resin 3%, benzoyl peroxide 0.01%, ethyl acetate 75%.
[0010] Use one-fifth of the total ethyl acetate to dissolve benzoyl peroxide, prepare it into an ethyl acetate solution with benzoyl peroxide, and use one-fifth of the total ethyl acetate to dissolve SBS The resin is formulated into ethyl acetate solution in which SBS resin is dissolved, and brominated polystyrene resin is dissolved with ethyl acetate which accounts for one-fifth of the total, and it is formulated into ethyl acetate in which brominated polystyrene resin is dissolved Ester solution, add all the remaining ethyl acetate to the reactor, add ethyl methacrylate, vinyl acetate, hydroxypropyl acrylate, and hydroxyethyl acrylate to the reactor, add one-fifth of the butyl acrylate Add to ...
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