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Semiconductor device

A technology for semiconductors and devices, applied in the field of improving the whisker resistance of lead-free plating, and can solve problems such as coating rollout and failure to find

Inactive Publication Date: 2012-02-01
RENESAS ELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] There are various reasons for the appearance of tin whiskers, but it is speculated that the tin whiskers are caused by the coating being pushed out due to the application of compressive stress to the coating
Most of the measures used to remedy tin whiskers are countermeasures such as bake and reflow, and no effective remedy has been found in external processing

Method used

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  • Semiconductor device
  • Semiconductor device
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Embodiment Construction

[0059] In the following embodiments, in principle, the same or similar parts will not be described repeatedly, except in the case of a special need for explanation.

[0060] For convenience, the following embodiments are described as being divided into a plurality of parts of the embodiment when necessary, but unless otherwise noted, these embodiment parts are not independent of each other, but have such a relationship: a part of the embodiment is an embodiment A partial or total modification or a detailed description or supplementary explanation of another part of another part.

[0061] In the following embodiments, when referring to the number of elements (including numbers, values, quantities, and ranges), unless otherwise indicated and except for the case of being substantially limited to the mentioned number, it is not limited to the mentioned number , but will also be numbers above and below the numbers mentioned.

[0062] Needless to say, in the following embodiments, ...

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PUM

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Abstract

A semiconductor device having an improved whisker resistance in an exterior plating film is disclosed. The semiconductor device includes a tab with a semiconductor chip fixed thereto, plural inner leads, plural outer leads formed integrally with the inner leads, a plurality of wires for coupling electrode pads of the semiconductor chip and the inner leads with each other, and a sealing body for sealing the semiconductor chip. The outer leads project from the sealing body and an exterior plating film, which is a lead-free plating film, is formed on a surface of each of the outer leads. In the exterior plating film, the number of grains not larger than 1 [mu]m in diameter and present on an interface side in the thickness direction of the exterior plating film is larger than the number of grains not larger than 1 [mu]m and present on a surface side of the exterior plating film, whereby the difference in linear expansion coefficient between the exterior plating film and the outer lead is made small, thus making it possible to suppress the growth of whisker.

Description

[0001] Cross References to Related Applications [0002] The entire disclosure of Japanese Patent Application No. 2010-161699 filed on Jul. 16, 2010 including specification, drawings and abstract is hereby incorporated by reference. technical field [0003] The present invention relates to semiconductor device technology, and in particular, to a technology effectively applicable to improving whisker resistance of lead-free plating. Background technique [0004] As for a semiconductor integrated circuit device, there is known a structure in which an alloy layer having a melting point higher than that of tin-lead eutectic solder and not containing lead as a main constituent metal is formed in a portion other than the resin sealing portion (see Patent Document 1, for example) . [0005] Recently, the use of lead has been reduced due to environmental concerns, and lead-free plating has been increasingly applied. Lead-free plating has come to be widely used for surface treatme...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/488
CPCH01L2924/1576H01L2924/01014H01L2224/85439H01L23/3107H01L2224/97H01L2924/01322H01L2924/01029H01L24/32H01L2224/32245H01L2224/29139H01L2224/45144H01L2924/0132H01L2924/01028H01L2224/29111H01L24/04H01L24/73H01L24/45H01L2224/48465H01L2924/15738H01L2224/73265H01L2924/15747H01L24/48H01L23/49582H01L2224/48247H01L24/85H01L2224/04042H01L2224/48091H01L2224/45015H01L2224/48639H01L2924/181H01L2924/14H01L2224/85H01L2924/00012H01L2924/0105H01L2924/01026H01L2924/01047H01L2924/01082H01L2924/01083H01L2924/00014H01L2924/00H01L23/28H01L23/48H01L23/481
Inventor 村上智博加藤隆彦中村真人寺崎健
Owner RENESAS ELECTRONICS CORP