Printed circuit board

Abstract

The invention provides a printed circuit board, which comprises a circuit substrate, at least one build-up circuit structure, a top insulating layer, a conductive blind hole and a metal bump, wherein the circuit substrate is provided with a first circuit structure; the build-up circuit structure is arranged on the first circuit structure of the circuit substrate; the top insulating layer is formed on the at least one build-up circuit structure; the conductive blind hole is formed in the top insulating layer; the metal bump is arranged on the conductive blind hole in the top insulating layer; the metal bump and the conductive blind hole have different shapes or sizes. In another embodiment of the invention, a plurality of conductive blind holes are formed in the top insulating layer; a metal bonding pad is formed on a plurality of conductive blind holes; the size of the metal bonding pad is greater than that of the conductive blind holes; and the metal bonding pad is electrically connected with the electrical connection bonding pad of the at least one build-up circuit structure through conductive blind holes. By the invention, the comprehensive production time of the printed circuit board can be shortened, and the process cost can be reduced.

Description

technical field [0001] The invention relates to an electronic component, in particular to a printed circuit board. Background technique [0002] In order to meet the needs of light, thin, short, and small electronic products, the volume of substrates and semiconductor components also needs to be reduced. In addition, due to the high-speed, high-frequency and multi-functional operation requirements of semiconductor components, the number of input and output terminals continues to increase. Therefore, it is necessary to greatly increase the contacts between the printed circuit board and the chip (such as pre-solder bumps) to increase the circuit density of the printed circuit board, but the distance between the contacts must be continuously reduced. However, in the known printed circuit board technology, solder bumps are formed by steel plate opening and solder paste printing, which is limited by the ability of the steel plate to open loops, and solder bridges (solder bridges...

AI Technical Summary

Problems solved by technology

However, this known technology forms copper pillars on the green paint, which requires processes such as coating, exposure, development, and heat treatment. After the green paint layer is completed, the image transfer needs to be performed again on the top of the green paint open ring, and it is matched with electroplated copper. form copper pillars

The process is quite complicated and increases the burden on the exposure and development process

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