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Light-emitting diode

A technology of light-emitting diodes and electrodes, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of shortened working life of light-emitting diodes, air or water vapor infiltration, and low adhesion, so that it is not easy to yellow and work Long life, high temperature yellowing effect

Inactive Publication Date: 2012-02-08
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of using silica gel is higher than that of phenol methane resin, and the adhesion between silica gel and LED packaging substrate or cup shell material (such as polyphthalamide and metal) is not high, and air or The problem of moisture infiltration occurs, which will also cause the disadvantage of shortening the working life of LEDs

Method used

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Embodiment Construction

[0029] See figure 1 , the light emitting diode 10 provided by the first embodiment of the present invention includes a packaging substrate 11 , a reflective cup 12 , a light emitting diode die 13 and a packaging layer 14 .

[0030] The packaging substrate 11 is used to carry the LED die 13 . A circuit structure is provided on the packaging substrate 11 to supply power to the LED die 13 .

[0031] In another embodiment of the present invention, a reflective cup 12 is disposed on the packaging substrate 11 , and the reflective cup 12 is used for accommodating the LED die 13 and improving the light output of the LED die 13 . In an embodiment of the present invention, the packaging substrate 11 and the reflective cup 12 are integrally formed.

[0032] In this embodiment, the circuit structure of the packaging substrate 11 includes a first electrode 112 and a second electrode 114 . The first electrode 112 and the second electrode 114 are disposed on the surface 110 of the packag...

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PUM

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Abstract

The invention relates to a light-emitting diode, which comprises a packaging substrate, a light-emitting diode grain and a packaging layer, wherein the packaging substrate is provided with a circuit structure. The light-emitting diode grain is arranged on the packaging substrate, and the positive electrode and the negative electrode of the light-emitting diode are electrically connected with the circuit structure on the packaging substrate. The packaging layer covers the light-emitting diode grain and at least part of surface of the packaging substrate, and the packaging layer and the packaging substrate are respectively made of aliphatic epoxy resin. The homogeneous materials are used by the light-emitting diode, so that high sealing capability is formed between the packaging layer and the packaging substrate, and simultaneously, the light-emitting diode has long service life and high temperature resistance and is not easy to yellow.

Description

technical field [0001] The invention relates to a light emitting diode, in particular to a light emitting diode packaging structure. Background technique [0002] Now, light emitting diodes (Light Emitting Diode, LED) have been widely used in many fields, especially widely used in lamps and backlight modules. [0003] In the prior art, resins containing phenolic methane (also known as bisphenol A, Bisphenol A, BPA) are usually used to encapsulate light-emitting diode crystal grains. However, phenolic methane has poor heat resistance and is prone to yellowing at high temperatures. Problems, so it will reduce the working life of the light emitting diode after packaging. In addition, silicone can also be used for packaging the light emitting diodes. Compared with the above resins, silica gel can withstand high temperature and is not easy to yellow. However, the cost of using silica gel is higher than that of phenol methane resin, and the adhesion between silica gel and LED p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/48
CPCH01L33/56H01L2224/48091H01L2924/00014
Inventor 林升柏
Owner ZHANJING TECH SHENZHEN