Substrate transfer process system, substrate transfer process method, and apparatus and method for mounting component

Abstract

A substrate is transferred between a first operation apparatus and a second operation apparatus, while the substrate is kept in a fixed attitude in the horizontal direction by rotating and shifting a holding unit (70) using a substrate transfer apparatus which has: an arm section (61); a supporting shaft (62) which is fixed to one end of the arm section (61), rotatably supports the arm section within a horizontal plane and is disposed between the first operation apparatus and the second operation apparatus; a holding unit (70) which is supported by the other end of the arm section (61) and holds the upper surface of the substrate by suction; a rotary drive device (64) which rotates and shifts the holding unit (70) by rotating the arm section (61) with the supporting shaft (62) as the center of the rotation; and attitude maintaining mechanisms (66-69) which maintain the holding unit in the fixed attitude in the horizontal direction, while the holding unit is being rotated and shifted.

Description

technical field [0001] The present invention relates to a substrate handling system and method for transferring a substrate to a plurality of operating devices that perform predetermined operations on the substrate. A component mounting device and method for mounting components in a component mounting area of ​​a display panel represented by a panel, a plasma display panel, an organic EL panel, and the like. Background technique [0002] At present, by mounting electronic components, mechanical components, optical components and other components, flexible printed wiring boards (FPC substrates) on substrates such as liquid crystal display (LCD) panels and plasma display panels (PDP) (hereinafter referred to as "panel substrates") ), or COG (Chip On Glass), IC chips, COF (Chip On Film), TCP (Tape Carrier Package) and other semiconductor packaging components, etc., to manufacture display devices. [0003] With respect to the constitution of the existing component mounting line...

AI Technical Summary

Problems solved by technology

However, since the substrate transfer device 550 is disposed at the end E2, it cannot be said that the workability when removing the panel substrate 1 by manual work is good.

In addition, since the panel substrate 1 is large, the workability is further reduced.

[0009] In addition, in Figure 15 In the component mounting line 600, since the slide transfer device 650 is provided between the devices 610, 620, 630, and 640, the total length of the component mounting line 600 is enlarged

Especially in the case of handling a large panel substrate 1, the size of the slide transfer device 650 itself also increases, and the size of the component mounting line 600 in the transfer direction of the transfer panel substrate 1 becomes more significant.

Images