LED (light-emitting diode) packaging method and LED packaging structure

A technology of LED encapsulation and encapsulation method, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of cumbersome preparation process and complex substrate structure, and achieve the effects of simple substrate structure, prolonging the service life of LEDs, and good heat dissipation performance

Inactive Publication Date: 2012-02-15
SUZHOU DONGSHAN PRECISION MANUFACTURING CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Although this prior art can partially solve the problem of heat dissipation, the structure of

Method used

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  • LED (light-emitting diode) packaging method and LED packaging structure
  • LED (light-emitting diode) packaging method and LED packaging structure
  • LED (light-emitting diode) packaging method and LED packaging structure

Examples

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[0027] The LED packaging method uses a new substrate, the substrate uses an insulating base material as an insulating layer, and two copper substrates are interspersed on the lower end surface of the insulating layer, and corresponding circuits and electrodes are formed on them. The size of one copper substrate is larger than that of the other copper substrate, the positive electrode is formed on the large-sized copper substrate, and the negative electrode is formed on the small-sized copper substrate. An LED chip mounting slot is opened on the insulating layer, and the LED chip mounting slot is located at a position of the insulating layer superimposed on the large-size copper substrate. The LED chip mounting groove is arranged through the insulating layer, and the LED chip is placed on the exposed copper substrate at the bottom of the LED chip mounting groove, so that the LED chip is placed in the LED chip mounting groove. The insulating layer is also provided with two throug...

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Abstract

The invention discloses an LED (light-emitting diode) packaging method and an LED (light-emitting diode) packaging structure. In the packaging method, a baseplate is adopted, wherein the baseplate is provided with an insulating layer, and two copper baseplates are pasted on the lower end face of the insulating layer at equal intervals so as to respectively serve as a positive pole and a negative pole; the insulating layer is provided with an LED wafer installation groove, and an LED wafer is positioned in the LED wafer installation groove; the positive pole and negative pole of the LED wafer are respectively conducted with the two copper baseplates by use of two wires, and then a packaging material is laminated on the baseplate; the baseplate in the LED packaging structure only comprises the insulating layer and the copper baseplates, therefore the structure is simple, and the manufacturing cost is reduced; the through LED wafer installation groove is arranged on the insulating layer, so that the LED wafer is directly fixed on the copper baseplates, therefore the heat dispersion is good, and the service life of an LED is prolonged; and the packaging method of the LED adopts a surface mount technology for production, the manufacturing method is simple, and the manufacturing cost is low.

Description

technical field [0001] The invention belongs to LED encapsulation technology, and in particular relates to an encapsulation method and an LED encapsulation structure capable of surface-mounting an LED. Background technique [0002] Light Emitting Diode LED is a solid-state semiconductor device that converts electricity directly into light. The core component of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. The traditional packaging process and packaging structure of LED cannot meet the requirements of sufficient heat dissipation. In order to solve this problem, a packaging structure using a metal substrate for packaging to improve its heat dissipation performance has appeared in the prior art. [0003] For example, Chinese patent ZL201020545082.5 provides a special metal substrate for LEDs, which i...

Claims

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Application Information

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IPC IPC(8): H01L33/00H01L33/48
CPCH01L2224/48091H01L2224/48228H01L2924/00014
Inventor 袁永刚
Owner SUZHOU DONGSHAN PRECISION MANUFACTURING CO LTD
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