Grinding tool capable of actively compensating surface shape abrasion errors and compensating method thereof

An active compensation and grinding tool technology, applied in the direction of abrasives, manufacturing tools, metal processing equipment, etc., to achieve the effect of prolonging the service life and ensuring the processing quality

Inactive Publication Date: 2012-03-28
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is aiming at the defects of traditional error compensation, and proposes an abrasive tool that can active

Method used

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  • Grinding tool capable of actively compensating surface shape abrasion errors and compensating method thereof
  • Grinding tool capable of actively compensating surface shape abrasion errors and compensating method thereof
  • Grinding tool capable of actively compensating surface shape abrasion errors and compensating method thereof

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[0021] The technical scheme of the present invention will be further described in detail below in conjunction with the accompanying drawings:

[0022] Such as figure 1 As shown, the abrasive tool of the present invention includes an abrasive tool 2 with an abrasive grain layer on the upper surface thereof, and a piezoelectric ceramic array 3 is built in the abrasive tool 2. The built-in piezoelectric ceramic array 3 is used to adjust the surface profile or waviness of the abrasive tool 2 in real time, perform error compensation, and realize the precision machining of the workpiece 1.

[0023] Such as figure 2 As shown, m piezoelectric ceramic units are uniformly distributed in the abrasive tool 2, and each piezoelectric ceramic corresponds to a sample point on the surface of the abrasive tool; the voltage signal input terminal 7 is placed between the piezoelectric ceramic array and the abrasive tool base, and the voltage The signal input terminals correspond to the piezoelectric c...

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Abstract

The invention discloses a grinding tool capable of actively compensating surface shape abrasion errors and a compensating method thereof, belonging to the technical field of ultra-precision machining. The device disclosed by the invention actively compensates the surface shape errors of a grinding tool by use of a built-in piezoelectric ceramic array, wherein the piezoelectric ceramic array consists of a piezoelectric ceramic unit and a voltage signal input terminal; the piezoelectric ceramic array is arranged in the grinding tool; and the voltage signal input terminal is arranged between the piezoelectric ceramic array and a base body of the grinding tool. The method disclosed by the invention comprises the following steps of: uniformly placing the piezoelectric ceramic array in the grinding tool; and applying a certain DC (direct current) voltage signal to the piezoelectric ceramic in a corresponding position according to the initial surface shape or abrasion condition of the grinding tool, so that the piezoelectric ceramic generates corresponding telescopic deformation to force the surface shape of the grinding tool to change, thereby achieving the aim of adjusting the current surface shape of the surface of the grinding tool. The grinding tool disclosed by the invention has a simple structure and a high mechanical integration degree, is stable and reliable, and has broad application prospects in precision machining, and particularly in surface shape machining.

Description

technical field [0001] The invention relates to a grinding tool and a method for actively compensating surface wear errors, and belongs to the technical field of ultra-precision machining. Background technique [0002] The processing of ultra-precision devices requires that the material density be highly consistent and the nanometer precision of the size, waviness, and roughness be achieved at the same time. When using traditional material removal methods, it is difficult to achieve ultra-low stress and difficult to achieve material removal under ultra-low stress. . With grinding as the basic processing method, it is necessary to achieve nano-scale dimensional accuracy, surface accuracy, surface waviness, surface roughness, and have good surface quality, small surface metamorphic layer, small residual stress, and meet surface integrity requirements , in addition to the need for the grinding machine to provide a feed that is better than nanometer precision, and accurately co...

Claims

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Application Information

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IPC IPC(8): B24D3/00
Inventor 金家楣吴飞陈小建季瑞南
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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