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Silicic miniature microphone

A microphone and silicon micro technology, applied in the direction of electrostatic transducer microphone, etc., can solve the problems of damage to silicon acoustic chip and poor reliability, and achieve the effect of improving yield, improving reliability and preventing damage.

Inactive Publication Date: 2012-03-28
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a silicon acoustic chip that can protect the internal silicon acoustic chip for the defects that may damage the silicon acoustic chip and cause poor reliability due to dust and water in the use of the traditional silicon micro microphone. The silicon micro-microphone structure of the film protects it from the impact of external airflow, greatly improving the ability of the microphone to withstand airflow blowing and suction; at the same time, it also has the effect of dustproof and waterproof, which improves the reliability of the microphone

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] figure 1 It is a sectional view of a silicon micro-microphone according to the embodiment of the present invention, as figure 1 As shown, the silicon micro-microphone includes an upper plate 11 combined from top to bottom, a side wall formed by a hollow cavity 12, and an external packaging structure formed by a circuit board lower plate 2, which is arranged on the upper plate 11 There is a first sound inlet 11, and the inside of the packaging structure is provided with a silicon acoustic chip 4 and an electrical signal processing chip 3 installed on the lower board 2 of the circuit board; an isolation device 5 is also provided on the upper board 11 inside the packaging structure to isolate A buffer cavity is formed between the device 5 and the upper plate 11. A second sound inlet 51 connecting the first sound inlet 11 and the silicon acoustic chip 4 is provided on the isolation device 5. The first sound inlet 11 and the second A blocking sheet 6 is also arranged betw...

Embodiment 2

[0025] figure 2 It is a sectional view of the second silicon micro-microphone of the embodiment of the present invention, as figure 2 As shown, the main difference between this implementation process and Embodiment 1 is that the two ends of the blocking piece 6' in this implementation process are provided with opposite direction supports 61', so that the structure of the blocking piece 6' presents an S shape.

[0026] This design, in practical application, the structural characteristics of the blocking sheet 6' makes it have a greater sound transmission effect, which can meet the needs of more production designs for sound transmission.

Embodiment 3

[0028] image 3 It is a sectional view of the silicon micro-microphone of the embodiment of the present invention, as image 3 As shown, the main difference between this implementation process and the above-mentioned implementation process is that the setting of the isolation device 5' is different, and the isolation device 5' in this implementation process is arranged on the lower board 2 of the circuit board.

[0029] The design of this implementation process can also achieve the above-mentioned technical effect, and the design of the isolation device in this implementation process is more convenient when assembling the silicon micro-microphone.

[0030] In the implementation of the present invention, the blocking sheet can also be in other shapes such as L shape, and the design of the specific shape can be selected according to the requirements of the sound penetration effect; the upper plate and the cavity can also be independent structures, that is, three-layer plate stru...

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Abstract

The invention discloses a silicic miniature microphone which comprises an outer packaging structure, wherein the outer packaging structure comprises an upper board, a hollow cavity forming the side wall, and a lower plate of a circuit board; a first voice inlet hole is arranged in the upper board, and a silicic acoustical chip and an electric signal chip are arranged on the lower board of the circuit board; and a separation device for separating the first voice inlet hole from the silicic acoustical chip is arranged in the packaging structure, a buffer cavity is formed between the separation device and the upper board, and a second voice inlet hole for communicating the first voice inlet hole with the silicic acoustical chip is arranged in the separation device; a stop sheet is arranged between the first voice inlet hole and the second voice inlet hole, and the thickness of the stop sheet is smaller than the height of the buffer cavity. Due to the design, the structure of the silicic miniature microphone of the vibration film of the internal silicic acoustical chip can be protected, and is free of outside airflow impaction, the airflow blow-suck resistant capacity of the microphone is improved, simultaneously, the waterproof and dustproof effects are improved, and the reliability of the microphone is improved.

Description

technical field [0001] The invention relates to the field of acoustic-electric converters, in particular to a silicon micro-microphone. Background technique [0002] With the development of terminal consumer electronic products, more and more acoustic-electric transducers are widely used. In the field of acoustic-electric conversion technology, a silicon micro-microphone, or MEMS microphone (Micro-Electro-Mechanical Systems-Microphone), is a MEMS acoustic-electric integrated micro-processing technology that uses silicon as a raw material and integrates electronics and micro-mechanics. The sound-to-electricity conversion device of the conversion chip. Compared with traditional capacitive miniature microphones, MEMS microphones have gradually penetrated into the field of consumer electronics due to their small size, high performance, high temperature reflow resistance, and low cost advantages of mass production. [0003] Traditionally structured silicon micro-microphones, su...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R19/04
Inventor 庞胜利
Owner GOERTEK INC
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