Semiconductor package, method of manufacturing semiconductor package, and optical module

A manufacturing method and semiconductor technology, applied in the field of WLCM, can solve the problems such as the increase in the number of processing steps or the cost, and achieve the effect of low cost

Inactive Publication Date: 2016-04-20
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, this method has a problem that the number of processing steps or the cost increases

Method used

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  • Semiconductor package, method of manufacturing semiconductor package, and optical module
  • Semiconductor package, method of manufacturing semiconductor package, and optical module
  • Semiconductor package, method of manufacturing semiconductor package, and optical module

Examples

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Embodiment Construction

[0023] In the following, preferred embodiments of the disclosed technology are described in detail with reference to the accompanying drawings. It is to be noted that description is made in the following order.

[0024] 1. Embodiment (example of camera module in which electromagnetic light-shielding shielding film is formed on its side and back)

[0025] 2. Modified example (another example of the wiring layer forming step)

[0026]

[0027] figure 1 A cross-sectional structure of a camera module 1 is shown, which is an optical module according to an embodiment of the disclosed technology. refer to figure 1 , the camera module 1 is used for an optical device such as an image sensor device and includes a lens unit 20 included in a wafer level package 10 that is a semiconductor package. The camera module 1 is mounted on a printed board such as a motherboard on its lower side (ie, on its wafer level package 10 side) and allows light to enter from its upper side (ie, from it...

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PUM

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Abstract

The present invention relates to a semiconductor package, a method of manufacturing the semiconductor package, and an optical module. The semiconductor package includes: a supporting substrate; a functional element and a first bonding element formed on a first main surface of the supporting substrate; a sealing substrate arranged in an opposing relationship with the supporting substrate, the functional element and the first bonding element Located between the sealing substrate and the supporting substrate; the second bonding element is arranged on the second main surface of the supporting substrate; the through-electrode is arranged in the supporting substrate and extends through the supporting substrate, and is suitable for connecting the first bonding element and the second bonding element The two bonding elements are electrically connected; and a first electromagnetic shielding film is coated in an entire area of ​​a side surface of the support substrate extending perpendicularly to the first and second main faces.

Description

technical field [0001] The technology disclosed in the present invention relates to a semiconductor package such as a WCSP (Wafer Level Chip Scale Package) and a WLCM (Wafer Level Camera Module) using the semiconductor package. Background technique [0002] With the improvement of integration technology in recent years, reduction in size and weight of electronic devices, reduction in operating voltage and power consumption, and increase in operating frequency have been rapidly advanced. Therefore, demand for area array type packages such as BGA (Ball Grid Array), LGA (Land Grid Array), and CSP (Chip Scale Package) is increasing. Recently, advanced technologies such as WCSP using through-hole electrodes have also begun to spread. [0003] A WCSP is a semiconductor package formed by performing a forming process step of sealing resin or external terminals at the stage of a wafer before dicing. With the WCSP of the kind just described, when the chip is mounted on a printed boa...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146H01L23/498
CPCH01L27/14618H01L27/14687H01L2924/0002H01L2924/00H01L23/48H01L23/481H01L23/60
Inventor 鈴木优美长尾真行伊藤康幸
Owner SONY CORP
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