Solar silicon wafer automatic wafer separator based on cyclic distribution device and wafer separation method thereof

A technology for solar silicon wafers and slicing machines, which is applied to electrical components, conveyor objects, transportation and packaging, etc., can solve the problems of fragile and difficult separation of silicon wafers, and achieves reduction of fragmentation rate, efficient separation, and improvement of production efficiency. and reliability effects

Active Publication Date: 2012-04-25
RES INST OF ZHEJIANG UNIV TAIZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The thickness of the solar silicon wafer is about 0.2mm after cutting. Since the gap between two solar silicon wafers is very close, it is easy to adsorb each other and not easy to separate, and the silicon wafer is fragile.

Method used

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  • Solar silicon wafer automatic wafer separator based on cyclic distribution device and wafer separation method thereof
  • Solar silicon wafer automatic wafer separator based on cyclic distribution device and wafer separation method thereof
  • Solar silicon wafer automatic wafer separator based on cyclic distribution device and wafer separation method thereof

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Embodiment Construction

[0043] Such as figure 1 As shown, the present invention is based on the solar silicon chip automatic slicer of the circulation gas distribution device, comprising a feed system, a transmission system, and a circulation gas distribution device 7, and a circulation gas distribution device is arranged on one side of the feed system, and the circulation gas distribution device passes through The transmission system realizes the drive.

[0044] Such as figure 2 As shown, the feed system includes a feed box 1, a transmission rod 29, and a linear motor 15, the output shaft of the linear motor 15 is connected to one end of the transmission rod 29, and the other end of the transmission rod 29 is fixedly connected to the feed box 1; the linear motor 15 passes through the The vertical plate is supported and fixed, and a plurality of guide rods 30 are arranged between the vertical plate and the feed box 1;

[0045] There is a gap fit between the feed box 1 and the guide rod 30; a gap f...

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Abstract

The invention discloses a solar silicon wafer automatic wafer separator based on a cyclic distribution device, which comprises a feed system, a drive system and a cyclic distribution device. The cyclic distribution device is arranged on one side of the feed system, a distribution shaft sleeve of the cyclic distribution device is connected with a plurality of vacuum generators, and each vacuum generator corresponds to one suction head assembly so that the cyclic distribution device is provided with a plurality of stations; the drive system comprises two sets of chain drive devices driven by the same driving shaft, the chain drive device No.1 drives the vacuum generators to rotate by the distribution shaft sleeve of the cyclic distribution device, and the chain drive device No.2 drives eachsuction head assembly to rotate; and a horizontal conveyor belt assembly is fixedly arranged above the drive system. According to the solar silicon wafer automatic wafer separator based on the cyclicdistribution device, disclosed by the invention, on the premise of not damaging solar silicon wafers, the solar silicon wafers can be efficiently separated, and the fragmentation rate is reduced. Theinvention further discloses a wafer separation method of the solar silicon wafer automatic wafer separator based on the cyclic distribution device.

Description

technical field [0001] The invention relates to a silicon chip slicer, in particular to an automatic solar silicon slice slicer based on a circulation gas distribution device. The invention also relates to a slicing method of a solar silicon chip automatic slicing machine. Background technique [0002] The thickness of the solar silicon wafer is about 0.2mm after cutting. Since the gap between two solar silicon wafers is very close, it is easy to adsorb each other and not easy to separate, and the silicon wafer is fragile. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an automatic slicer for solar silicon wafers based on a circulation gas distribution device, which can realize automatic slices. [0004] In order to solve the above-mentioned technical problems, the technical solution of the solar silicon chip automatic slicing machine based on the circulation gas distribution device of the present invention is:...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18B65G47/91
CPCY02P70/50
Inventor 王维锐刘木林鄢光明
Owner RES INST OF ZHEJIANG UNIV TAIZHOU
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