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Backlight module and LED (light emitting diode) module

A technology of light-emitting diodes and modules, applied in the fields of light-emitting diode modules and backlight modules, can solve the problems of large number of light-emitting diodes, high power, aging of lighting sources, etc., and achieve the effect of good heat dissipation effect.

Inactive Publication Date: 2012-05-02
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Light-emitting diodes will generate heat when they work, leading to premature aging of lighting sources, especially in products such as TVs that require a large number of light-emitting diodes and high power. If the heat generated by light-emitting diodes is not effectively dissipated, the service life will be seriously affected

Method used

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  • Backlight module and LED (light emitting diode) module
  • Backlight module and LED (light emitting diode) module
  • Backlight module and LED (light emitting diode) module

Examples

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Embodiment Construction

[0026] Please refer to figure 1 The light emitting diode module provided by an embodiment of the present invention comprises a heat sink 10, a plurality of light emitting diode chips 20 arranged on the heat sink 10, a phosphor layer 30 arranged on the heat sink 10 and covering the light emitting diode chips 20, and heat dissipation The thermoelectric conversion device 40 connected to the board 10 and the cooling fan 50 connected to the thermoelectric conversion device 40 .

[0027] The heat dissipation plate 10 can be made of materials with good heat dissipation performance, such as ceramics. A circuit layer 12 is also provided on the heat dissipation plate 10 , and the circuit layer 12 may be formed on the heat dissipation plate 10 by using techniques such as lithographic etching.

[0028] The LED chip 20 may be an InGaN series LED chip. Preferably, the light-emitting diode chip 20 is directly packaged on a circuit board (Chip On Board, COB), which can avoid the additional ...

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Abstract

The invention relates to an LED (light emitting diode) module. The LED module comprises a heat sink, a plurality of LEDs arranged on the heat sink, a thermoelectric conversion device, a cooling fan and thermocouples embedded in the heat sink, wherein the thermocouples are connected with the thermoelectric conversion device; the cooling fan is electrically connected with the thermoelectric conversion device; the thermoelectric conversion device converts absorbed heat into electric energy and supplies the electric energy to the cooling fan; and the cooling fan is used for cooling the heat sink. The invention also provides a backlight module with the LED module. In the LED module, heat generated by LED chips is converted into the electric energy, and the electric energy is supplied to the cooling fan to cool the LED module, so that the LED module has a good cooling effect and can fulfill the aims of energy saving and carbon reduction.

Description

technical field [0001] The invention relates to a light emitting diode module and a backlight module using the light emitting diode module. Background technique [0002] Semiconductor light-emitting diodes, with their advantages of high luminous efficiency, small size, light weight, and environmental protection, have been widely used in various fields, such as light sources for indicator lights, lighting lamps, and TV / computer display screens. . [0003] When light-emitting diodes are used as lighting sources for TVs and computers, the number of light-emitting diodes is generally large, and multiple light-emitting diodes are made on a long strip to form a light bar, and then a plurality of light bars form a TV or computer display screen. The whole lighting source. Light-emitting diodes will generate heat when they work, leading to premature aging of the lighting source. Especially in products such as TVs, which require a large number of light-emitting diodes and high power...

Claims

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Application Information

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IPC IPC(8): F21S8/00F21V29/00F21V9/10F21Y101/02F21V9/40F21V29/50F21V29/67
Inventor 方荣熙
Owner ZHANJING TECH SHENZHEN
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