Hot melt glue temperature liquid level control method in hot melt glue groove and temperature liquid level controller thereof
A liquid level controller and liquid level control technology, applied in non-electric variable control, control/regulation systems, and simultaneous control of multiple variables, etc., can solve the problems of cumbersome installation and wiring, prone to malfunction, and high price. Achieve the effect of not easy electromagnetic interference, low output impedance and good stability
Active Publication Date: 2013-08-28
东莞市奥通米克电子有限公司
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Problems solved by technology
Since capacitive sensor probes must be made of high-temperature-resistant non-metallic materials, the operating temperature of capacitive sensors is limited. Therefore, if the capacitive sensing control circuit is directly placed inside the high-temperature probe, it is difficult to ensure the normal operation of the device in a high-temperature environment. Therefore, , the probe must be placed separately from the circuit part
However, after the capacitive sensor probe is placed separately from the control circuit, the signal path is susceptible to electromagnetic interference, poor reliability, and prone to malfunction. Moreover, the control output method of the capacitive sensor controller is simple, and the signal is output, and there is no signal. When the received signal is wrong, the control of the capacitive sensor controller is also wrong; in addition, because the control circuit needs to be installed independently outside the hot melt glue tank, the installation and wiring are cumbersome; because the capacitive sensor controller And probes are expensive, which is not conducive to cost saving for enterprises
Method used
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[0063] The structural principle and working principle of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0064] Such as figure 1 As shown, in the prior art, the hot-melt glue temperature liquid level control method in the hot-melt glue tank 4 includes the step of controlling the heater 6 to heat the hot-melt glue tank 4 or stop heating, in this step, the thermoelectric The couple 20 collects the temperature and transmits it to the temperature controller 17, and the temperature controller 17 controls the opening and closing of the heater 6 through the PID algorithm; it also includes controlling the opening of the electromagnetic valve 7 between the hot-melt glue storage box 5 and the hot-melt glue tank 4 Or the step of closing, in this step, hot-melt glue is coated on the product continuously by gluing roller 9, and capacitive sensor probe 19 collects the distance change amount with the hot-melt glue liquid level ...
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The invention discloses hot melt glue temperature liquid level control method in a hot melt glue groove and a temperature liquid level controller thereof. The temperature liquid level control method comprises the following steps: placing a second thermocouple in hot melt glue, placing a first thermocouple above a hot melt glue liquid level and collecting temperature values respectively; setting apreset temperature value and a preset temperature difference value in the temperature liquid level controller; comparing the temperature value collected by the second thermocouple with the preset temperature value and controlling open and closure of a second relay; comparing a difference of the temperature value collected by the second thermocouple and the temperature value collected by the firstthermocouple and controlling the open and closure of a first relay. By using the control method and the temperature liquid level controller of the invention, an anti-electromagnetic interference capability is strong, stability is good and control is accurate. An installation space can be saved. Concentration control can be performed conveniently. Wiring can be simplified. Costs of the whole temperature liquid level control system can be greatly reduced.
Description
technical field [0001] The invention relates to the field of industrial automation control, in particular to a method for controlling the temperature and liquid level of hot-melt glue in a hot-melt glue tank and a temperature and liquid-level controller. Background technique [0002] The process of applying the hot melt adhesive to the product in the factory, including the process of adding the hot melt adhesive in the molten state from the hot melt adhesive storage tank to the hot melt adhesive tank, and coating the hot melt adhesive in the molten state from the hot melt adhesive tank The process of distributing on the product; in this process, the temperature of the hot-melt adhesive is controlled by a temperature controller in the hot-melt adhesive storage box, and the temperature of the hot-melt adhesive is determined according to the needs of the product. Therefore, when the hot-melt adhesive enters the After the hot-melt glue tank, the temperature of the hot-melt glue ...
Claims
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IPC IPC(8): G05D27/02
Inventor 谷岸江谷鹏
Owner 东莞市奥通米克电子有限公司