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Parameter optimization method and system in sparking ball formation technique

An optimization method and ball-forming technology, applied in semiconductor devices, electrical components, circuits, etc., can solve problems such as no content found, and achieve the effect of reducing time and frequency

Inactive Publication Date: 2012-05-02
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] No content similar to the present invention has been found in the retrieval of the existing monitoring pyrotechnic process and related technologies

Method used

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  • Parameter optimization method and system in sparking ball formation technique
  • Parameter optimization method and system in sparking ball formation technique
  • Parameter optimization method and system in sparking ball formation technique

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040]Embodiment 1: Monitoring of 25 micron diameter gold wire into ball process based on high-speed camera

[0041] Photron FASTCAM SA1.1 high-speed camera acquisition system is adopted. The most notable feature of this system is that it can shoot and record at high speed and obtain clear image data. The fastest frame number reaches 6.5×10 5 Frames per second, maximum resolution up to 1024×1024 pixels, shooting time up to seconds. The lens adopts the confocal optical system of Zoom 6000 from Navitar Company. The optical magnification of this optical system used in this patent is 20 times. Connect with Photron FASTCAM SA1.1 high-speed camera acquisition system through standard C port.

[0042] Work process of the present invention:

[0043] First connect the ignition voltage signal to the reverse amplification circuit, after passing through this circuit, the voltage signal is reversed and amplified by 10 times, and then this signal is connected to the high-speed camera, so ...

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PUM

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Abstract

The invention discloses a parameter optimization method and system in a sparking ball formation technique for micro-electronic packaging automatic lead bonding. The method comprises the following steps: connecting an automatic bonding machine with a camera through a synchronous driving circuit; aligning a lens in the camera with a tail fiber; determining sparking parameters, and synchronously triggering the camera to acquire multiple continuous ball formation images at the tail fiber end in the sparking ball formation process by using the synchronous driving circuit when the automatic bonding machine carries out sparking ball formation; and acquiring gold ball fitted diameter by an image circle fitting method, comparing the gold ball fitted diameter with the reference value, and adjusting the sparking parameters, wherein the sparking parameters comprise sparking time and sparking current. The method and system disclosed by the invention can be used for quickly determining the influence of the sparking parameters on the gold ball formation process so as to optimize the technological parameters of the sparking ball formation as quickly as possible.

Description

technical field [0001] The invention belongs to the field of microelectronic packaging machinery, and relates to a parameter optimization method and system in a sparking and ballizing process. Background technique [0002] Wire bonding is the most important microelectronic packaging technology at present, and more than 95% of chips are packaged by wire bonding technology. Wire bonding is to use fine metal wires (gold wires, copper wires or other metal wires with a diameter of 25 microns or less, for the convenience of description, the most common gold wires are used as a representative in the following description) to bond the chip pad and the lead frame (or substrate) ) process of connecting. In the process of wire bonding, first, the gold wire passes through the hole in the center of the capillary chopper (ie, the tail wire), and the protruding part of the gold wire is melted by the arc discharge, and a gold ball is formed under the action of surface tension; The knife m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/60H01L21/50
CPCH01L2224/85045H01L2224/78271H01L24/78H01L24/85H01L2224/85205H01L2224/45144H01L2224/45147H01L2224/85H01L2224/78H01L2924/00H01L2924/00014H01L2924/00012
Inventor 王福亮向康韩雷李军辉
Owner CENT SOUTH UNIV
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