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Copper oxide containing gloss agent and manufacturing method thereof

A glossy agent, copper oxide technology, applied in the direction of copper oxide/copper hydroxide, etc., can solve the problems of glossy agent consumption, inability to analyze or improve the composition and replenishment of glossy agent, waste, etc., to simplify the process, improve work efficiency and The effect of product quality

Inactive Publication Date: 2012-05-09
江德馨
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the formulation of the gloss agent is very precise and must be matched with the composition of the electroplating solution and various electroplating conditions. Generally, electroplating factories cannot do such fine control
Regardless of whether it is a soluble anode or an insoluble anode, the gloss agent will be consumed, so it must be replenished continuously, and the amount of replenishment is difficult to control. Too much replenishment will cause waste or even have adverse effects, and too little replenishment will affect the quality of the coating
In the past, electroplating factories used Hull cell or Haring cell to test the coating properties of circuit boards. However, they can only observe the appearance of the workpiece to know whether the current distribution is appropriate, and cannot determine the gloss. The composition and supplementary amount of the agent should be further analyzed or improved

Method used

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  • Copper oxide containing gloss agent and manufacturing method thereof
  • Copper oxide containing gloss agent and manufacturing method thereof
  • Copper oxide containing gloss agent and manufacturing method thereof

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Embodiment Construction

[0035] In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments are listed below and described in detail in conjunction with the accompanying drawings.

[0036] Please also refer to Figure 1 to Figure 3 , which is an example of the copper oxide containing a gloss agent and the method for producing the copper oxide containing a gloss agent of the present invention.

[0037] Such as figure 1 As shown, the gloss agent-containing copper oxide 1 of the present invention includes copper oxide 10 and gloss agent 20 . The copper oxide includes a surface 11 and several holes 12 , and the gloss agent 20 is attached to the surface 11 and the several holes 12 .

[0038] In an embodiment of the present invention, the copper oxide 10 is copper oxide powder, but the present invention is not limited thereto. In another embodiment of the present invention, the gloss agent 20 includes a very high current scorch...

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Abstract

The invention provides copper oxide containing a gloss agent, comprising the copper oxide and the gloss agent, wherein the copper oxide comprises a surface and a plurality of holes, and the gloss agent is adhered on the surface or the holes. The copper oxide containing the gloss agent and a manufacturing method thereof provided by the invention can precisely allocate the gloss agent and make the gloss agent be adhered on the copper oxide, so as to prevent electroplating factories from self-calculating and replenishing the loss of the gloss agent, the working procedures are simplified, and the working efficiency and the product quality are improved.

Description

technical field [0001] The present invention relates to a copper oxide containing a gloss agent and a method for manufacturing the copper oxide containing a gloss agent, in particular to a copper oxide containing a gloss agent and an oxidation method for manufacturing a gloss agent containing a gloss agent attached to copper oxide. copper method. Background technique [0002] In recent years, with the rapid progress of the electronics industry, the production proportion of multilayer boards is getting higher and higher. The requirements for quality and reliability of multi-layer boards have far exceeded the specifications for double-layer boards, and the quality of the plating layer of circuit boards has become an important quality assurance item. [0003] Electroplating anodes can be divided into soluble anodes and insoluble anodes. The soluble anode is made of titanium baskets containing phosphorus copper blocks. Several titanium baskets are placed separately on both sid...

Claims

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Application Information

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IPC IPC(8): C01G3/02
Inventor 江德馨
Owner 江德馨