Wafer surface morphology detection method

A technology of surface topography and topography, applied in the field of detecting wafer surface topography, can solve the problems of complex structure of lithography machine, wafer focusing, increase production cost, etc., and achieve the effect of improving yield, ensuring focusing, and ensuring accuracy
CN102455600AActive Publication Date: 2012-05-16SEMICON MFG INT (SHANGHAI) CORP +1
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Patent Information

Authority / Receiving Office
CN ยท China
Current Assignee / Owner
SEMICON MFG INT (SHANGHAI) CORP
Publication Date
2012-05-16

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Abstract

The invention provides a wafer surface morphology detection method. The method comprises the following steps: 1, selecting a wafer of a plurality of dies with same whole relative surface morphologies; 2, selecting a first die, aligning the central position of a detection point array at the central position of the first die, and determining the first relative surface morphology of the first die by detecting the first absolute surface morphology of the first die; 3, selecting a second die, deviating the central position of the detection point array from the central position of the second die, and determining the second relative surface morphology of the second die by detecting the second absolute surface morphology of the second die; 4, determining the whole relative surface morphologies of the two dies by merging the first relative surface morphology and the second relative surface morphology; and 5, detecting partial absolute surface morphologies of other dies on the wafer, and obtaining the whole absolute surface morphologies of all the dies through the partial absolute surface morphologies and the whole relative surface morphologies. According to the invention, a "blind spot" problem generated by spaces between each two light spots can be avoided.
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Description

technical field

[0001] The invention relates to a semiconductor manufacturing process, in particular to a method for detecting the surface topography of a wafer. Background technique

[0002] Photolithography technology has been widely used in integrated circuit manufacturing process. This technology exposes through a photolithography system to transfer the designed mask pattern to the photoresist. The concepts of "mask" and "photoresist" are well known in the photolithography process: the mask is also called a photoresist, which is a substrate of film, plastic or glass with various functional patterns ( A template for photoresist, which is used for selective exposure of photoresist; photoresist is a colloidal liquid mixed with photosensitive compound, matrix resin and organic solvent. A change in chemical structure that changes the solubility characteristics in a certain solution.

[0003] Since the lithography process determines the feature size of the final integrat...

Claims

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