Bonding apparatus and bonding method
A bonding device and a technology for bonding parts, which are applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of large wiring impedance, decreased productivity of wafer bonding processing, and a large amount of time to achieve high-efficiency bonding, The effect of improving productivity
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[0040] Hereinafter, embodiments of the present invention will be described. figure 1 It is a longitudinal cross-sectional view which shows the schematic structure of the joining apparatus 10 provided with the adapter 1 for pressing. figure 2 It is a transverse cross-sectional view showing a schematic configuration of a joining device 10 having a pressing attachment 1 .
[0041] In the engagement device 10, such as image 3 As shown, for example, two wafers W are used as substrates. U , W L join. Hereinafter, the wafer arranged on the upper side may be referred to as "upper wafer W". U ”, the wafer arranged on the lower side is called “lower wafer W” L ”. Each wafer W U , W L Joints J each having a plurality of metals U , J L . In addition, each junction J is U , J L abutting the wafer W U , W L Lamination to form a laminated wafer W as a laminated substrate T , and then the wafer W U , W L joined to each other. In addition, in the process of wafer W U , W ...
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