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Capping assisting device

An auxiliary device and capping technology, which is applied in the direction of measuring devices, microstructure devices, instruments, etc., can solve the problems of easy direct contact of glue, reduce the efficiency of the packaging process, and overflow of glue, so as to improve the packaging efficiency and packaging reliability. Effect

Active Publication Date: 2014-09-03
WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] However, both methods obviously have the following disadvantages: manual intervention on the package body cover is required one by one, which greatly reduces the efficiency of the MEMS packaging process for large-scale package manufacturing
And in the first method, during the intervention process, due to the need to press down, the glue will overflow, and the overflowing glue is easy to directly contact with the hands, or penetrate the protective device and touch the hands, which is easy to cause damage to the workers' skin

Method used

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Examples

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Embodiment Construction

[0031] Presented below are some of the many possible embodiments of the invention, intended to provide a basic understanding of the invention. It is not intended to identify key or critical elements of the invention or to delineate the scope of protection.

[0032] figure 1 Shown is a schematic structural view of the capping auxiliary device provided according to the embodiment of the present invention. In this embodiment, the MEMS chip is packaged with an OCDIP lead frame, but the specific package form and the corresponding specific lead frame type are not limiting. For example, in addition to the OCDIP (Open Cap Dual In_line Package) package shown in this embodiment, OCSOP (Open Cap Small Outline Package Six Leads) with 6 pins or 14 pins can also be used. , Small outline package) and other packaging forms. Because in the capping step, all MEMS chips on the lead frame array are capped and packaged at the same time, therefore, in order to improve efficiency, figure 1 The i...

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PUM

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Abstract

The invention provides a capping assisting device, which belongs to the technical field of chip packaging. The capping assisting device is used for pressing a capped packaging body cap on a lead frame array in the capping process of micro electro mechanical system (MEMS) chip packaging, and comprises a base plate, a plurality of pressing rods and a handheld device, wherein the handheld device is fixed on the base plate; the first ends of the pressing rods are provided with elastic bodies which are used for softly contacting the packaging body cap when the packaging body cap is pressed; and the second ends of the pressing rods are fixed on the base plate. The capping assisting device can efficiently press the capped packaging body cap in the packaging process of the MEMS chip, and greatly improve the packaging efficiency and the packaging reliability of the MEMS chip.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, relates to MEMS (Micro-Electro-Mechanical System, micro-electro-mechanical system) chip packaging, and in particular to a package body cap used for capping a lead frame array in the capping process of the MEMS package Capping aid for pressing down. Background technique [0002] In the packaging technology of MEMS chips, due to the particularity of MEMS chips, its packaging process is somewhat different from that of other ordinary chips. Usually, for a common chip, it is formed by fixing the chip (for example, gold wire bonding) on ​​the lead frame and then encapsulating the package body. For the packaging of MEMS chips, firstly, the lead frame is plastic-sealed to form a plastic package, and a cavity is formed on the plastic package; then the packaged MEMS chip is placed in the cavity and bonded and fixed, and finally used The package lid covers the cavity. The final step of covering th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B81B7/00
Inventor 朱翠云
Owner WUXI CHINA RESOURCE MICRO ASSEMBLY TECH
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