Probe card detection method and system

Abstract

The invention relates to a probe card detection method and a probe card detection system. The probe card detection method mainly comprises the following steps of: moving an image pickup device to one of a plurality of regions on a probe card on an XY plane by a three-axis displacement mechanism so as to pick up probe point images of a plurality of probes in the region; moving the image pickup device in a Z-axis direction until a first clear probe point image is obtained, further moving the image pickup device to the probe corresponding to the clear probe point image and recording a group of actual measured coordinate data displayed by a three-axis optical scale; repeating the same operation mode to obtain coordinate data of all the probes in all the regions of the probe card; and finally, comparing a difference value of X coordinate values and a difference value of Y coordinate values with corresponding allowed tolerance values, calculating a difference value of median Z coordinate values of all the groups of coordinate data and other Z coordinate values, comparing the difference values of the median Z coordinate values and the Z coordinate values with an allowed tolerance value, and judging that the probe card is unqualified if one of the difference value of the X coordinate values, the difference value of the Y coordinate values and the difference value of the median Z coordinate values and the Z coordinate values exceeds the corresponding allowed tolerance value.

Description

technical field [0001] The invention relates to a probe card detection method and system, in particular to a method and system for detecting probe card usability. Background technique [0002] After the integrated circuit components on the silicon wafer are manufactured, before the subsequent packaging process, the silicon wafer testing process is required to eliminate bad integrated circuit components and improve the packaging yield. Generally speaking, the silicon wafer testing method is to use multiple probes to correspondingly contact the electrical pads on the integrated circuit element, thereby measuring the electrical characteristics of the integrated circuit element, so as to judge whether the integrated circuit is good or bad. When the probe card is used for a period of time, the problem of probe deformation and wear will inevitably occur. Therefore, probe detection is required to determine whether it needs to be repaired. [0003] At present, there are two ways to...

AI Technical Summary

Problems solved by technology

The disadvantage of the existing probe card detection method is that the measurement takes a long time and the measurement value cannot exclude personal visual errors

However, the disadvantage of the current automatic detection equipment is that it cannot measure the length of the tip of the probe, and it needs to be supplemented by manual inspection to form a multi-task position conversion, which wastes manpower and inspection time.

[0004] In particular, contact measurement is used for flatness measurement, that is, the probe slides on a detection fixture plane, which will cause the material consumption of the fixture, and also cause the accumulation of particles in the formed groove, so the measured flatness underestimated

Images