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Detection method of plating binding quality of metallic film

A metal thin film and coating technology, applied in the direction of testing material hardness, etc., can solve the problems of large load, high cost, destructive testing, etc., and achieve the effect of small influence, good repetition and small limitation

Inactive Publication Date: 2012-06-20
ZTE CORP
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Problems solved by technology

[0006] The instrument using the Rockwell indenter--the Rockwell hardness tester has a large load. The minimum load used by the common Rockwell hardness tester on the market is 15kgf. Generally, a large indentation will be formed, which will have a significant impact on the overall appearance of the sample. It belongs to destructive testing;
[0007] In addition, the indentation depth of the sample is relatively deep. In order to ensure that no bending deformation occurs during the loading process of the sample and affect the test results, according to the requirements of the indentation method, the thickness of the substrate is required during the test, and the indentation depth is required to be less than 1 / of the sample thickness. 10, so the Rockwell indentation method is suitable for large samples but not suitable for measuring thin materials below 1mm or small-sized samples, products with complex shapes, etc.;
[0008] If you want to change these defects, you need to use a special loading system to reduce the loading load, and you need to use special instruments and equipment, which greatly increases the cost of implementing this test method, and the economical practicability is low.

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  • Detection method of plating binding quality of metallic film
  • Detection method of plating binding quality of metallic film
  • Detection method of plating binding quality of metallic film

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Embodiment Construction

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0030] The embodiment of the present invention provides a method for detecting the bonding quality of a metal thin film coating, such as figure 2 Shown is the principle diagram of the coating bonding quality test. Use a Vickers hardness tester to press the Vickers indenter into the surface of the coating with a preset load. The indenter penetrates the coating into the surface of the substrate, causing mechanical deformation of the coating and the substrate. When there is residual stress between the coating and the substrate, In the case of defects suc...

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Abstract

The invention relates to the metal plating technology, and provides a detection method of plating binding quality of a metallic film. The detection method comprises the steps of: carrying out impress loading on a sample to be tested by using a Vickers hardness tester; comparing appearance of the plating with observed impress points with a reference map, and evaluating the level of the plating binding quality. The technical scheme has low dimensional limit, is suitable for research and judgment of plating binding quality of thin materials and small-size samples, and is also suitable for testing large-size samples; the sample is loaded by using a Vickers pressing head, and the testing is carried out by using the Vickers hardness tester, thus approximate nondestructive test is realized and the integral appearance of the product is not influenced; impress testing is carried out by using the Vickers hardness tester, the load size, loading rate and load retention time can be accurately controlled, the influence of the test conditions is low and the testing has good repeatability; and finally, the scheme can directly use a standard microhardness Vickers hardness tester to test, the operation is simple, convenient and quick, special instruments are not needed, and the method is economical and practical and has good universality.

Description

Technical field [0001] The invention relates to a metal coating technology, in particular to a method for detecting the bonding quality of a metal thin film coating. Background technique [0002] Metal and plastic shells used in electronic products today generally have to undergo surface treatment, electroplating and electroless plating, as well as PVD, CVD and other thin film technologies to increase their beauty, corrosion resistance and wear resistance. Widely used, where the bonding quality of the thin film coating is very important to the reliability of the product surface. [0003] The previous methods of studying and judging the bonding quality of the coating mainly used the scratch method and the hundred grid method. These methods are limited by the test conditions and personnel operations, such as the depth and uniformity of the scratches, and the bonding effect of the hundred grid tape. The repeatability is poor, the test environment such as temperature, humidity has ext...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/42
Inventor 郑镇嵘宋好强李二勇
Owner ZTE CORP
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