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A structured sawing wire

A technology of sawing wire and hacksaw, applied in the field of structured sawing wire, can solve the problems of absence of cavities or protrusions, limited sawing effect, serious abrasive wear effect, etc.

Active Publication Date: 2012-07-04
BEKAERT BINJIANG STEEL CORD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this round shape is that abrasive particles initially trapped between the wire and the workpiece tend to be pushed out from between the wire and the workpiece
[0019] However, the problem with these solutions is that the abrasive action of the abrasive grains is very severe, and the surface of the saw wire has been polished after five to ten passes on the workpiece, and no cavities or protrusions exist.
Therefore, the sawing action is limited to these parts and is not as good as expected

Method used

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Examples

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Embodiment Construction

[0082] Figure 1a The shape of a prior art structured saw wire as described in WO2006 / 067062 is shown. The saw wire is circular with a diameter of 0.25 mm. As described in the penultimate third paragraph on page 8, the saw wire is scanned three-dimensionally, and these three figures show three projections of the saw wire center on the YZ, YX, and XZ planes. The wire has been rotated about the Z axis so that the projection clearly shows waves in two mutually perpendicular bending directions. The waveform on the YZ plane clearly shows a wavelength of about 3.0mm, while the projection on the XZ plane shows a longer wavelength of about 5.2mm. The half-amplitude of the waveform is about 0.04mm, making the diameter of the entire circumscribed cylinder of the wire about 0.33mm. This wire is hereinafter referred to as reference wire "Ref".

[0083] Contrary to Figure 3 in WO2006 / 067062, the projection of the thus shaped saw wire on the XY plane shows a Lissajous figure (not a cros...

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Abstract

A steel sawing wire (302) with a helicoidal shape, wherein straight segments alternate with outwardly oriented bends is described. The shape of the sawing wire (302) is configured so as to have a good cooperation with the abrasive particles the wire is used with in the following way: when the wire (302) is used gaps form at the segments between the bends and the circumscribed semi-cylinder formed by the workpiece that is being cut. The gaps have a maximum gapsize that is from 0.25 to 2 times the median diameter of the abrasive particles used. In this way at the gaps active, large particles are pushed against the workpiece while worn abrasive debris escapes through the gaps. Additionally several manufacturing methods are described which result in such kind of wire (302).

Description

technical field [0001] The invention relates to the field of sawing wires designed for cutting hard and brittle materials. In particular, the invention relates to cutting of, for example, quartz (for eg quartz oscillators or photolithographic masks), silicon (for eg integrated circuit wafers or solar cells), gallium arsenide (for high frequency circuits), silicon carbide (for example, Saw wires of materials such as those used for blue LEDs), rare earth magnetic alloys (such as used for recording heads). Background technique [0002] The multi-wire sawing of hard and brittle materials in the electronics industry seems to be invented by C. Hayward of British Thomson-Houston Cy Co., Ltd., which is related in GB717874 (disclosed in 1954) and GB771622 (disclosed in 1957) describe. This technology has been further obtained by H.W.Mech of Motorola Company, and there is relevant description in GB1397676 (opened in 1975). [0003] All the features of a modern multi-wire saw can be...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/06B28D5/04B28D7/00C03B33/00C03B33/10
CPCB23D61/185
Inventor H·罗梅尔
Owner BEKAERT BINJIANG STEEL CORD CO LTD
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