Adhesive material coating device
A coating device and coating technology, which is applied in the direction of assembling printed circuits with electrical components, rotary printing machines, printing, etc., can solve the problems of increasing the number of parts and device structure constraints, etc.
Active Publication Date: 2014-10-29
YAMAHA MOTOR CO LTD
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Problems solved by technology
Therefore, the user can detect (confirm) the remaining amount of solder paste in the cartridge which cannot be visually confirmed from the outside in the adhesive material coating device according to the above-mentioned patent document.
[0004] However, in the adhesive material coating device involved in the above-mentioned patent documents, in order to detect the remaining amount of the adhesive material (solder paste), it is necessary to provide a displacement rod and a scale plate dedicated to the detection of the remaining amount, so there is a corresponding problem that the device Structural constraints and increased number of parts
Method used
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[0017] Below, refer to Figure 1 to Figure 7 , the configuration of the printing apparatus 100 according to one embodiment of the present invention will be described. In addition, in this embodiment, an example in which the "adhesive material coating device" of the present invention is applied to a printing device for printing solder on a printed wiring board will be described.
[0018] printing device 100 such as figure 1 and figure 2 As shown, it includes a base 1 , a substrate conveying unit 2 disposed on the base 1 and conveying a printed circuit board 200 , and a printing unit 3 disposed above the substrate conveying unit 2 and performing solder printing on the printed circuit board 200 . In addition, the printed circuit board 200 is an example of the "substrate" of this invention.
[0019] The substrate conveying section 2 comprises: a conveying belt 4a, which carries out the printed circuit board 200 before printing; a conveying belt 4b, which carries out the printe...
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PROBLEM TO BE SOLVED: To provide an adhesion material application apparatus in which a structural restriction attributable to the detection of a residual amount of an adhesion material can be reduced, and an increase in the number of components can be suppressed.SOLUTION: The printing apparatus (adhesion material application apparatus) 100 includes: a servo motor 723 for supplying solder paste 111 by causing a solder container 110 and a piston 112 to make a relative movement; a motor control means for performing drive control of the servo motor 723 based on the value of detection by an encoder 723a and controlling an amount of supply of the solder paste 111; a squeegee 711 for applying the solder paste 111; and a residual amount calculating means for calculating information on the residual amount of the solder paste 111 contained in the solder container 110 based at least on the information to make the connection between the relative position of the solder container 110 and the piston 112, and the drive position of the servo motor 723, and the present position of the servo motor 723 detected by the encoder 723a.
Description
technical field [0001] The present invention relates to an adhesive material coating device, in particular to an adhesive material coating device capable of detecting the remaining amount of the adhesive material. Background technique [0002] Conventionally, an adhesive material application device capable of detecting the remaining amount of the adhesive material is known (for example, Japanese Patent Laid-Open Publication No. 2001-253046). [0003] The above-mentioned patent document discloses an adhesive material coating device, which includes: a cassette provided with a supply port and storing solder paste; a pressure plate that squeezes out the solder paste in the cassette; and an air cylinder that presses the pressure plate. to supply solder paste from the cassette. In this adhesive material coating device, the user can read the index mark on the displacement rod that moves with the displacement of the pressure plate (extrusion of solder paste) from the scale on the f...
Claims
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IPC IPC(8): B41F15/08B41F31/02
CPCB41F15/08B41F15/40B41F33/0027B41F33/0036H05K3/12H05K3/34
Inventor 藤本猛志
Owner YAMAHA MOTOR CO LTD