Additive manufacturing device and method for micro-system three-dimensional structure

Abstract

The invention relates to an additive manufacturing device and method for a micro-system three-dimensional structure, and belongs to the field of additive manufacturing. A high-viscosity microdroplet extrusion nozzle is fixed to a guide upright column through a supporting frame, an X-axis moving device is fixed to a base, a Y-axis moving device is fixed to the X-axis moving device, a deflection electric field electrode is installed on the guide upright column through a Z-axis moving device, a dielectric layer adheres to an electrode array, the electrode array is fixed to the Y-axis moving device, and a polarization module is fixed to the base and above the dielectric layer. According to the device and method, a layered manufacturing technology is utilized, the technical characteristic thatliquid material droplets solidify and are formed under a pulsed electric field, and the precise control over additive manufacturing is realized by using a pulsed electric field separation technology.Accurate jetting of the micron-scale droplets is achieved by adjusting voltage parameters so as to achieve high-viscosity liquid high-frequency jetting.

Description

technical field [0001] The invention belongs to the technical field of additive manufacturing, and in particular relates to an additive manufacturing device and method for ultra-thin functional layers with high precision volume control and shape control. Background technique [0002] In recent years, research work in the field of microsystem manufacturing at home and abroad has progressed rapidly, and a large number of research results have been achieved in two-dimensional integration and micro-nano processing. At the level of structural design, the chip-level two-dimensional integration of multiple microsystems at the same time improves the functional density to a certain extent, but the increase in the number of microsystems will lead to a sharp increase in the two-dimensional size of the device. The combination of two-dimensional integrated chips through space optimization forms a three-dimensional structure, which not only improves the space utilization rate but also inc...

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Problems solved by technology

[0005] (1) Difficulties in the separation of sub-micron microfluids: the current commonly used extrusion or separation methods (piezoelectric method and thermal bubble method) have problems in the injection of ultrafine fluids. The problem is that it is difficult to achieve a small amount of injection less than 1pl liquid

[0006] (2) Droplets cannot be precisely positioned on the working platform: For micron-sized droplets, their precise positioning requires high precision of the position control of the printing platform. A piezoelectric linear platform is required, but its formation range is only tens of microns, and the cost High and th

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