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Deposition of thermoelectric materials by stamping

A technology of thermoelectric materials and polymer materials, which is applied in the directions of thermoelectric device junction lead-out materials, printing, and post-processing of printing, etc., which can solve the problems of heavy implementation and difficult large-scale application.

Inactive Publication Date: 2012-07-04
COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The technology is onerous to implement, making it difficult to apply at scale

Method used

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  • Deposition of thermoelectric materials by stamping
  • Deposition of thermoelectric materials by stamping
  • Deposition of thermoelectric materials by stamping

Examples

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Embodiment Construction

[0022] It is proposed herein that the internal stresses are limited due to the removal of solvent and polymer material by spray depositing the ink. The spraying conditions are chosen such that a part of the solvent evaporates when the deposition takes place. A porous layer is then obtained which will allow stress relaxation when the final removal of the additive takes place.

[0023] figure 2 The steps of a method of producing a layer of thermoelectric material with relaxed stress are shown in flow chart form.

[0024] In step F1, an ink compatible with spray printing techniques is prepared. The ink contains a thermoelectric material designed to form a thermocouple, a polymeric material and a solvent.

[0025] The thermoelectric material is preferably in the form of semi-metallic or semiconductor particles having a diameter comprised between 10 nm and 10 μm dispersed in a solvent. Thermoelectric materials can be selected from alloys of bismuth and tellurium, such as Bi fo...

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Abstract

The invention relates to deposition of thermoelectric materials by stamping. A method for producing a layer of thermoelectric material with a thickness comprised between 50 [mu]m and 500 [mu]m on a substrate comprises (F1) preparing an ink comprising the thermoelectric material, a solvent and a binding polymer material, (F2) depositing a layer of ink on a substrate, (F3) heating the layer of ink to evaporate the solvent, (F4) compressing the layer and (F5) performing heat treatment to eliminate the binding polymer material. Deposition (F2) of the layer of ink is performed by pressurized spraying under conditions such that the solvent is partially evaporated before reaching the substrate.

Description

technical field [0001] The present invention relates to the production of thermoelectric modules, and more particularly to the deposition of layers of thermoelectric material by printing. Background technique [0002] A thermoelectric module comprises several thermoelectric elements, also called thermocouples, connected electrically in series and thermally in parallel. The performance of such modules depends on the thermoelectric materials used and the geometry of the modules. [0003] Thermoelectric materials are usually chosen to have a high figure of merit ZT at the operating temperature of the module. The quality factor is written as: [0004] ZT = σ · S 2 λ T , [0005] where σ is the electrical conductivity, S is the Seebeck coefficient, λ is the thermal conductivity and T is the temperature. Product σ·...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L35/34B05D1/02B05D7/24
CPCB41M7/00B41M5/0011B41M7/009H01L35/34H01L35/16H10N10/852H10N10/01
Inventor C.纳冯M.索里尔
Owner COMMISSARIAT A LENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
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