High-radiation film type metal compound material and manufacturing method thereof

A technology of metal composite materials and manufacturing methods, applied in the direction of metal layered products, chemical instruments and methods, heat exchange equipment, etc., can solve the problems of low hardness and inconvenient use

Inactive Publication Date: 2012-07-11
上海杰远环保科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] The existing high heat dissipation graphite film and graphene film are extremely thin and have low hardness. Although they have excellent heat dissipation performance, they are inconvenient to use

Method used

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  • High-radiation film type metal compound material and manufacturing method thereof
  • High-radiation film type metal compound material and manufacturing method thereof
  • High-radiation film type metal compound material and manufacturing method thereof

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Embodiment Construction

[0032] The present invention will be further described below in conjunction with specific embodiments with reference to the accompanying drawings.

[0033] Picture 1-1 and Figure 1-2 They are structural schematic diagrams of two different lamination forms of the high heat dissipation film-type metal composite lamination structure. A high heat dissipation film metal composite material according to the present invention includes a metal body layer and a high heat dissipation film layer overlapping with it, wherein the metal body layer and the high heat dissipation film layer comprise at least three layers.

[0034] like Picture 1-1 As shown, the laminated structure metal body layer and the high heat dissipation film layer include three layers in total. And with the metal body layer 110 as the base, the high heat dissipation film layer 120 is located between the two metal body layers 100 .

[0035] Correspondingly, in practical applications, the metal body layer 110 and the ...

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Abstract

The invention provides a high-radiation film type metal compound material and a manufacturing method thereof and belongs to the technical field of a high-radiation material. The compound material comprises three parts, namely metal layers, high-radiation film layers and a metal frame, wherein the high-radiation film layers are overlapped with the metal layers and the metal frame is used for cladding the edges of the metal layers and the edges of the high-radiation film layers. The manufacturing method comprises the following steps: firstly, respectively preparing the metal layers and the high-radiation film layers; interactively overlapping the metal layers and the high-radiation film layers till forming overlapping structures with required layer number; utilizing the metal frame to fix the overlapping structures of the metal layers and the high-radiation film layers; heating, thereby melting the contacting metal between the overlapping structures of the metal layers and the high-radiation film layers and between the metal frame and the overlapping structures; and reducing temperature, cooling and solidifying, thereby realizing the integral adhering forming. The structure of overlapped metal layers is adopted and the metal frame is used for cladding and fixing, so that the hardness of a high-radiation film is increased.

Description

technical field [0001] Technical field of high heat dissipation materials. Background technique [0002] Electronic products, machinery, electric power, communications, chemical industry and many other fields will generate different amounts of heat in the process of product processing, production and use. Moreover, if the generated heat cannot be effectively dissipated, it may affect the processing and use of the product. [0003] Various heat dissipation materials are widely used at present. Different types of heat dissipation materials have different properties. For example, metal materials have good thermal conductivity, especially some metal materials, such as copper, aluminum, silver, etc., have particularly good thermal conductivity. For example, copper radiators and aluminum radiators are widely used. [0004] The thermal conductivity properties of some commonly used heat dissipation materials are listed below: [0005] Aluminum: 237W / m K; Copper: 401W / m K; [0...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/04B32B15/00B32B3/06B32B37/06B32B37/08F28F3/08
Inventor 不公告发明人
Owner 上海杰远环保科技有限公司
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