Grabbing manipulator system for semiconductor packaging equipment

Abstract

The invention relates to a grabbing manipulator system for semiconductor packaging equipment. The system comprises a mechanical grabbing device, an air cylinder grabbing device and a pressing plate buffering device, wherein the mechanical grabbing device comprises a guide rod fixing block, a claw, a guide rod, a first spring and a grabbing fixing block; the air cylinder grabbing device comprises an air claw, a slide rail fixing block and a slide rail; and the pressing plate buffering device comprises a substrate, a guide shaft, a third spring, a guide shaft fixing plate, a stop sheet, a linear bearing, a pressing plate and a pressing plate fixing block. Compared with the prior art, the manipulator system for grabbing the semiconductor packaging equipment is simple in structure, does not occupy space, and can adapt to a semiconductor product of which width and thickness are in certain range; when different types of products are machined, replacement and adjustment are not required; the equipment is stable in running and low in cost; and the production efficiency and the utilization efficiency of the equipment are greatly improved.

Description

technical field [0001] The invention relates to semiconductor technology, in particular to a product grabbing device for semiconductor packaging equipment. Background technique [0002] In the semiconductor packaging process, the product has to go through the process of loading, operation and unloading in each process. [0003] Most of the current fully automatic loading and unloading equipment adopts the way of suction plate loading and unloading, and the products are sucked out from the material basket or track and sent to the designated place. Due to the wide variety of semiconductor products and different frame sizes, it is necessary to replace different suction plates when changing the type of equipment, resulting in an increase in spare parts and cumbersome actions for changing types. The suction nozzle is a consumable part, which needs to be replaced frequently, and the cost of use is high. Moreover, the suction plate has high requirements on the position of the prod...

AI Technical Summary

Problems solved by technology

Due to the wide variety of semiconductor products and different frame sizes, different suction plates need to be replaced when the equipment is changed, resulting in an increase in spare parts and cumbersome changes in the variety.

The suction nozzle is a consumable part, which needs to be replaced frequently, and the cost of use is high, and the suction plate has high requirements on the position of the product, and a slight deviation in the position will cause suction failure

With the development of semiconductors, products are getting smaller and smaller, making it more difficult to absorb products, and frequent failures of product absorption failures greatly reduce the stability and efficiency of equipment operation

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