Insulation structure used for fixing electronic element, electronic element and component

A technology for insulating components and electronic components, applied in the direction of circuit layout, elastic/clamping devices, etc. on the support structure, which can solve the problems of short insulation distance, short-circuit ignition, damage to circuit boards, etc.

Active Publication Date: 2015-01-21
FENGJIE DONGYANG BUILDING MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The insulation distance is short, the insulation strength is not enough, it is easy to cause short circuit and fire, and damage the circuit board

Method used

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  • Insulation structure used for fixing electronic element, electronic element and component
  • Insulation structure used for fixing electronic element, electronic element and component
  • Insulation structure used for fixing electronic element, electronic element and component

Examples

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Embodiment

[0031] An embodiment of the present invention provides an insulating structure of an electronic component, such as figure 2 As shown, the insulation structure includes:

[0032] The first hollow insulating member 12 includes an upper thick portion 121 and a lower thin portion 122, the outer diameter of the thick portion 121 is greater than the outer diameter of the thin portion 122, the inner diameter of the thick portion 121 is equal to the inner diameter of the thin portion 122, the first insulating member 12 The outer diameter of the detail 122 satisfies that when the detail 122 passes through the mounting hole of the electronic component, the outer surface of the detail 122 fits with the mounting hole of the electronic component;

[0033] The ring-shaped second insulating member 13, the second insulating member 13 is arranged in the mounting hole to be installed on the heat sink, the mounting screw passes through the hollow first insulating member 12, and the detail 122 o...

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PUM

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Abstract

An insulation structure for fixing an electronic element, an electronic element and an assembly can extend insulation distances, and increase insulation degrees to enable the voltage-withstand level to meet the insulation requirements. The insulation structure comprises a first hollow insulation member (12) which comprises a thick part (121) of an upper section and a thin part (122) of a lower section, wherein the outer diameter of the thick part (121) is greater than that of the thin part (122), the inner diameter thereof is equal to that of the thin part (122), and the dimension of the outer diameter of the thin part (122) meets the following: when penetrating through a mounting hole of an electronic element, the outer surface of the thin part (122) is closely adhesive to the mounting hole; and a ring-shaped second insulation member (13) which is arranged in a mounting hole to be installed in a heat dissipation plate (50), wherein a mounting screw (30) penetrates through the first insulation member (12), the thin part (122) of the first insulation member (12) penetrates through the mounting hole of the electronic element and the second insulation member (13), the second insulation member (13) is sleeved outside the thin part (122) of the first insulation member (12), and the inner surface of the second insulation member (13) is closely adhesive to the outer surface of the thin part (122) of the first insulation member (12). The insulation structure is used for fixing an electronic element, so as to improve the insulation effect of the electronic element.

Description

technical field [0001] The invention relates to the field of electronic circuits, in particular to an insulating structure for fixing electronic components, an electronic component and an assembly of electronic components. Background technique [0002] A field effect transistor (Metal Oxide Semiconductor, MOS) is an electronic component commonly used in modern industrial design. It is mainly used in digital logic circuits to realize switching logic, that is, logical 0 or 1. In practical applications, it is usually necessary to fix the MOS tube with screws, and at this time, the MOS tube must be insulated from the screws. [0003] Such as figure 1 As shown, in the prior art, the MOS tube 20 is fixed on the circuit board by screws 30 , and the circuit board is laid with a heat dissipation insulating pad 40 and a heat dissipation plate 50 . The screw 30 is separated from the MOS tube 20 by the insulating structure 11. The length of the broken line A in the figure is the insul...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/12
CPCH05K7/12
Inventor 王绪伟侯保船武磊磊
Owner FENGJIE DONGYANG BUILDING MATERIALS CO LTD
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