Semiconductor device and method for manufacturing same
A manufacturing method and semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of easy disconnection of bonding wires and inability to ensure bonding state, etc., and achieve high bonding strength and sufficient bonding reliability Effect
Active Publication Date: 2012-07-11
NICHIA CORP
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Problems solved by technology
Therefore, since the second bonding wire is in a state of being bonded above the peripheral portion of the ball neck, there is a possibility that a good bonding state cannot be ensured.
In addition, since the first bonding wire around the above-mentioned convex portion is compressed between the capillary surface and the spherical portion, it is crushed into a thin state, so the bonding wire is likely to be broken at this portion. problem exists
Method used
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Embodiment
[0099] Image 6 is a schematic plan view showing the semiconductor device of this embodiment. image 3 and Figure 4 It is a schematic sectional process drawing for demonstrating the wire bonding of the semiconductor device of this Example.
[0100] Such as Image 6 As shown, the semiconductor device 10 of this embodiment includes a semiconductor element 11, a plate-shaped metal member 12, bonding wires for electrically connecting between the semiconductor element 11 and the metal member 12 and between the semiconductor elements 11, and they are integrally bonded with a resin. Sealed molded body 19 is formed. A protective element 13 electrically connected to the metal member 12 is also mounted on the semiconductor device 10 .
[0101] The metal member 12 is a plate-shaped body made of an aluminum alloy, and includes a region where the semiconductor element 11 is mounted and a region extending in one direction from the region.
[0102] The molded body 19 is integrally molde...
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Disclosed are: a semiconductor device that comprises a semiconductor element to which a plurality of wires are bonded, wherein bonding strength of the wires is high and sufficient bonding reliability is achieved; and a method for manufacturing the semiconductor device. Specifically disclosed is a semiconductor device which is characterized by comprising a first wire that has one end bonded onto an electrode and the other end bonded to a second bonding point that is out of the electrode, and a second wire that has one end bonded onto the first wire on the electrode and the other end bonded to a third bonding point that is out of the electrode. The semiconductor device is also characterized in that the bonded portion of the first-mentioned end of the second wire covers at least a part of the upper surface and the lateral surface of the first wire.
Description
technical field [0001] The present invention relates to a semiconductor device and a manufacturing method thereof, and more specifically, to a semiconductor device including a semiconductor element that is wire-bonded inside the semiconductor device or to another semiconductor element and to a manufacturing method thereof. Background technique [0002] Among conventional semiconductor devices using semiconductor elements such as light-emitting diodes, there is a semiconductor device in which a plurality of semiconductor elements are mounted in one package, and a method of connecting such a plurality of semiconductor elements by bonding wire bonding has been proposed (for example, , Patent Document 1). According to this method, when performing bonding wire connection (wire bonding) between a plurality of semiconductor light emitting elements, first, wedge bonding is performed as a first bonding wire from the terminal of the electrode pattern of the package to the upper electr...
Claims
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Login to View More IPC IPC(8): H01L21/60H01L33/62
CPCH01L2224/48479H01L2224/45124H01L2224/4911H01L2224/85191H01L24/78H01L2224/48699H01L24/85H01L2924/01028H01L2924/01013H01L24/49H01L2924/20751H01L2224/45015H01L24/48H01L25/0753H01L2224/49426H01L24/45H01L2924/20753H01L2924/01033H01L2924/01074H01L2924/01078H01L33/62H01L2924/01015H01L2924/01082H01L2924/01004H01L2224/49425H01L2924/01002H01L2924/01019H01L2224/4809H01L2924/01029H01L2224/85469H01L2224/85051H01L2224/45169H01L2224/45147H01L2224/8518H01L2224/48599H01L2224/78301H01L2924/01047H01L2224/48137H01L2924/01079H01L2224/85186H01L2224/48465H01L2924/14H01L2924/01005H01L2924/01006H01L2924/20754H01L2224/49429H01L2224/45144H01L2224/48799H01L2224/85181H01L2224/05616H01L2224/05624H01L2224/05644H01L2224/05647H01L2224/48139H01L2224/48669H01L2224/48769H01L2224/48869H01L2224/85203H01L2224/85205H01L2924/00014H01L2924/12041H01L2924/181H01L2924/20752H01L2224/48471H01L2924/00H01L2224/4554
Inventor 濑野良太
Owner NICHIA CORP