Sapphire slice electric swing mechanism

Abstract

The invention discloses a sapphire slice electric swing mechanism which comprises a swing head and a swing device. The swing head is connected with a sapphire working table; the swing device is arranged in the swing head; the swing device comprises an arc rack, a swing component and a driving device which are fixedly arranged on the swing head; the lower end of the swing device is provided with a gear; the gear is meshed with the arc rack; and the swing component is movably arranged on the swing head. When the sapphire slice electric swing mechanism works, the driving device drives the swing component to swing, the swing head is driven by the matching of the gear and the arc rack to swing and a sapphire crystal bar is driven to be inclined left and right around the crystal bar axis, so that a cutting surface which is in contact with a diamond wire and takes the integral crystal bar as the center is changed into a local cutting surface which takes the crystal bar axis as the center and the diamond wire can rapidly cut the sapphire crystal bar, and thus, the cutting efficiency is improved.

Description

technical field [0001] The invention relates to an oscillating mechanism, in particular to an electric oscillating mechanism for cutting sapphire, belonging to the technical field of sapphire slicing equipment. Background technique [0002] Sapphire is an important material for processing blue light diodes and plays a pivotal role in the semiconductor field. Sapphire is sliced ​​before being formed into sapphire linings. In the prior art, the sapphire is mostly processed by wire-cutting technology, and the sapphire is sliced ​​by a high-speed moving cutting wire during processing. Sapphire lining slicing is a very important process in the manufacture of sapphire substrates. It determines the total thickness change, warpage, surface roughness and other related quality of the wafer after sapphire slicing, which directly affects the next double-sided grinding. Chamfering, polishing and other processes. Due to the large contact area of ​​the cutting line in the traditional ve...

AI Technical Summary

Problems solved by technology

Due to the large contact area of ​​the cutting line in the traditional vertical line downward cutting method during the cutting process, problems such as slow cutting, long cutting time and low efficiency are caused.

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