Ceramic capacitor and preparation method of the ceramic capacitor

A technology of ceramic capacitors and buffer materials, which is applied to fixed capacitor casings/packages, components of fixed capacitors, etc., can solve the problems of large impact of ceramic chips, increased production costs, cracked ceramic chips, etc., and achieves excellent shock absorption and buffering capacity. The effect of good weather resistance and excellent insulation

Inactive Publication Date: 2012-07-18
FUJIAN TORCH ELECTRON TECH CO LTD
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  • Abstract
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Problems solved by technology

[0003] Ceramic capacitors are often encapsulated by resin molding. Since the expansion coefficient of resin is much higher than that of ceramic chips, after packaging ceramic capacitors with resin, various unstable conditions such as cracking of ceramic chips will occur due to changes in vibration, temperature, and humidity. , and the impact on the ceramic chip is extremely large during molding, which may easily cause unqualified products, resulting in increased production costs

Method used

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  • Ceramic capacitor and preparation method of the ceramic capacitor
  • Ceramic capacitor and preparation method of the ceramic capacitor

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Embodiment Construction

[0015] The present invention will be further described below through specific embodiments.

[0016] refer to figure 1 , a ceramic capacitor of the present invention includes a ceramic capacitor body 10 and an epoxy resin encapsulation layer 20 encapsulated outside the ceramic capacitor body 10, and between the ceramic capacitor body 10 and the epoxy resin encapsulation layer 20 There is a layer 30 of cushioning material. The ceramic capacitor body 10 is composed of multi-core ceramic capacitor chips, and the cushioning material layer 30 can be made of silicone, bonding glue or red glue and other cushioning materials.

[0017] When manufacturing a ceramic capacitor of the present invention, firstly, viscous silicone, bonding glue or red glue and other cushioning materials are coated on the outside of the ceramic capacitor body 10, and then epoxy resin is used for molding and encapsulation. encapsulation.

[0018] The above is only a specific embodiment of the present inventi...

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Abstract

The invention discloses a ceramic capacitor and a preparation method of the ceramic capacitor, the ceramic capacitor comprises a ceramic capacitor body and a resin encapsulating layer encapsulated at the outside of the ceramic capacitor body, and a buffering material layer is also arranged between the ceramic capacitor body and the resin encapsulating layer. Compared with the prior art, according to the ceramic capacitor and preparation method of the ceramic capacitor, as the buffering material layer is arranged between the ceramic capacitor body and the resin encapsulating layer, the product manufactured has excellent vibration absorption and buffering capability, thereby avoiding damage on the ceramic capacitor caused by impact during mould pressing, transport and application process.

Description

technical field [0001] The invention relates to a ceramic capacitor and a preparation method thereof. Background technique [0002] Ceramic capacitors have the characteristics of small size, large specific volume, long life, high reliability, and suitable for surface mounting, in addition to the characteristics of "blocking direct traffic" of capacitors. With the rapid development of the world's electronics industry, as the basic components of the electronics industry, ceramic capacitors are also developing at an astonishing speed, increasing at a rate of 10% to 15% every year. At present, the demand for ceramic capacitors in the world is more than 200 billion pieces, 70% of which come from Japan, followed by Europe, America and Southeast Asia (including China). With the improvement of the reliability and integration of chip products, its scope of use is wider and wider, and it is widely used in various military and civilian electronic machines and electronic equipment, suc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/224
Inventor 蔡明通贺卫东雷财万
Owner FUJIAN TORCH ELECTRON TECH CO LTD
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